Through Electrode Substrate Uniform Hole Distribution Warpage
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Through electrode substrates experience warping and distortion due to non-uniform hole distribution and varying rigidity, particularly when used in applications with uneven terminal layouts, leading to handling difficulties and manufacturing defects.
Innovation Solution
A through electrode substrate design with a combination of first and second holes, where the hole electrode parts of the second holes are electrically insulated from the first and second electrode parts, and the substrate includes insulation layers and electroconductive layers on the surfaces and sidewalls, with a uniform hole distribution to maintain rigidity and prevent deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If holes are provided in the substrate according to uneven terminal layout, then electrical connection requirements are met, but substrate rigidity becomes non-uniform causing warpage and distortion
Solution Approach 1:
The substrate is divided into different hole types: first holes with electrode parts for electrical connection and second holes without electrode parts for rigidity maintenance. This local differentiation allows the substrate to simultaneously meet electrical connection requirements and maintain uniform rigidity distribution, preventing warpage and distortion.
2Ease of operation
If holes are provided in the substrate, then electrical connections are enabled, but rigidity of the substrate lowers in the hole area making it easily deformed
Solution Approach 1:
Different regions of the substrate have different hole configurations: first holes with electrode parts provide electrical connection capability, while second holes without electrode parts maintain substrate rigidity. This local quality differentiation resolves the contradiction between enabling electrical connections and maintaining overall substrate strength.
Solution Approach 2:
The second holes act as intermediary structures that do not provide electrical connection but compensate for rigidity loss. These holes serve as a mediating element that balances the structural weakness introduced by first holes with electrical connection requirements while maintaining overall substrate strength.
3Strength
If uniform hole distribution is implemented, then substrate rigidity is maintained, but electrical connection requirements for uneven terminal layouts cannot be met
Solution Approach 1:
The substrate implements local quality differentiation by providing first holes with electrode parts in regions requiring electrical connection and second holes without electrode parts in regions requiring rigidity support. This allows the substrate to simultaneously achieve uniform hole distribution for rigidity maintenance and adapt to uneven terminal layouts for electrical connection requirements.
Data Source
AI summary
A through electrode substrate includes: a substrate; a first electrode part provided on a first surface side of the substrate; and a second electrode part provided on a second surface side of the substrate. The plurality of holes includes a plurality of first holes and a plurality of second holes. The hole electrode part of each first hole is electrically connected to the first electrode part on the first surface side of the substrate, and the hole electrode part thereof is electrically connected to the second electrode part on the second surface side of the substrate. The electrode part of each second hole is electrically insulated from the first electrode part on the first surface side of the substrate, or the hole electrode part thereof is electrically insulated from the second electrode part on the second surface side of the substrate.