Through-Glass Via Coating for Corrosion-Resistant Hermetic Enclosures

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Solution Overview

Problem

Existing hermetic glass enclosures with through glass vias (TGVs) made of metals like tungsten are prone to corrosion in corrosive environments, such as the human body, leading to potential failure and release of toxic substances.

Innovation Solution

A hermetic enclosure with a glass substrate and through glass vias (TGVs) featuring a conductive rod completely covered with a multilayer electrically conductive coating, including an adhesion layer, a corrosion-resistant diffusion barrier layer, and a biocompatible corrosion-resistant contact layer, to protect against corrosion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If metal through glass vias (TGVs) are used to establish electrical connections, then electrical connectivity is achieved, but corrosion resistance deteriorates in corrosive environments

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidcorrosion resistance
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies composite materials by creating a multilayer coating structure on the metal TGVs. The coating comprises multiple layers including a base metal layer, an intermediate layer, and a corrosion-resistant outer layer. This composite structure combines the electrical conductivity of metal with the corrosion resistance of protective coatings, resolving the contradiction between electrical connectivity and corrosion resistance in the corrosive body environment.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent introduces intermediary protective layers between the metal TGV and the corrosive environment. These intermediate coating layers act as mediators that prevent direct contact between the corrosive body fluids and the metal TGV, thereby protecting the electrical connection while maintaining biocompatibility. The intermediary layers serve as a buffer zone that preserves both electrical functionality and corrosion resistance.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Weight of moving object

If glass is used as enclosure material instead of titanium, then weight is reduced, but manufacturing complexity increases

Engineering Contradiction:
Improvehousing weightVSAvoidmanufacturing complexity
Core Design Contradiction:
Weight of moving objectVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by pre-forming the glass enclosure with integrated TGV structures before final assembly. The glass housing is manufactured with precisely positioned through-glass vias already incorporated, and the multilayer coating is applied in advance to protect the TGVs. This preliminary preparation simplifies the overall manufacturing process despite the inherent complexity of glass working, as it avoids the need for post-assembly modifications or complex multi-step fabrication sequences.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed solution effectively prevents corrosion of the conductive rods within the hermetic enclosure, ensuring reliable electrical connections and maintaining the enclosure's integrity in corrosive environments, such as within the human body.

Implementation Method 1

a corrosion resistant diffusion barrier layer (44)

Methodology Applied
Scientific EffectDiffusion barrier: Diffusion Barrier

Data Source

PatentEP4487903B1Hermetic enclosure comprising through glass vias and medical implant compris-ing such a hermetic enclosure
Publication Date: 2025.06.04 SCHOTT AG
  • EP4487903B1 patent drawingFigure 1~2
  • EP4487903B1 patent drawingFigure 3~5
  • EP4487903B1 patent drawing

AI summary

A hermetic enclosure (10) is provided comprising at least one glass substrate (12) having at least one electrical feedthrough configured as a through glass via (30), the via comprising a conductive rod (32) electrically connecting the inside of the hermetic enclosure (10) to the outside through the glass substrate (12), wherein the part of the conductive rod's (32) surface facing towards the outside of the hermetic enclosure (10) is completely covered with an electrically conductive coating (40), wherein the electrically conductive coating (40) is a multilayer structure comprising at least an adhesion layer (42) in direct contact with the conductive rod (32) and a corrosion resistant layer.