Through-Hole Interconnect Structure for High-Density 3D Electronics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional planar integration methods in electronic devices struggle to meet the increasing demands for higher performance and smaller sizes due to limited space, necessitating improved vertical interconnection and integration solutions.
Innovation Solution
An electronic device structure featuring a through hole and patterned conductive layer, with a conductive member thermally cured in the through hole, and an adhesive pattern layer to achieve vertical interconnection, using materials like glass, ceramic, and conductive materials such as copper and silver, along with insulating layers like Polyimide (PI) and Silicon Nitride.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional planar integration approach is used, then manufacturing process is simple, but integration density and functional density cannot meet increasing demands
Solution Approach 1:
The patent transitions from traditional planar (2D) integration to three-dimensional (3D) integration by stacking multiple conductive layer structures vertically on the core substrate. This dimensional change enables higher integration density by utilizing vertical space, allowing multiple functional layers to be integrated within the same footprint area, thereby resolving the contradiction between integration density and structural complexity.
Solution Approach 2:
The patent employs a nested structure where conductive layer structures are stacked vertically on the core substrate, with each layer containing conductive patterns, insulating layers, and adhesive layers nested within one another. This nesting approach maximizes the use of vertical space, enabling high integration density while maintaining a compact overall structure that does not excessively increase device footprint.
2Quantity of substance
If vertical interconnection is implemented through through holes and stacked conductive layers, then functional density increases, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs preliminary action by pre-forming through holes in the core substrate before stacking conductive layer structures. The through holes are prepared with precise dimensions and positions in advance, serving as guides for subsequent alignment. This preliminary preparation ensures that vertical interconnections can be accurately formed when conductive layers are stacked, thereby achieving high functional density while controlling manufacturing precision requirements.
Solution Approach 2:
The patent uses adhesive pattern layers as intermediary elements between the core substrate and conductive layer structures. These adhesive layers not only provide bonding functionality but also serve as alignment references and positioning features during the stacking process. The intermediary adhesive layers facilitate precise alignment of through holes with conductive patterns across multiple layers, reducing the overall manufacturing precision burden.
3Reliability
If conductive members are thermally cured in through holes to achieve vertical interconnection, then electrical connection reliability improves, but process complexity increases
Solution Approach 1:
The patent utilizes phase transition of conductive material during thermal curing process. The conductive material is applied in a paste or precursor form into the through holes, then undergoes thermal curing to transform into a solid, electrically conductive state. This phase transition enables reliable electrical connection formation through a well-established thermal processing step, achieving high connection reliability while avoiding overly complex manufacturing processes.
Solution Approach 2:
The thermal curing process serves multiple functions simultaneously: it cures the conductive material to establish electrical connections, bonds the adhesive pattern layers to secure the stacked structure, and provides structural stabilization. This self-service approach consolidates multiple manufacturing objectives into a single process step, improving electrical connection reliability without proportionally increasing process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the performance and functional density of electronic devices by enabling high integration and efficient vertical interconnections through the described structure and manufacturing method.
Implementation Method 1
providing a thermal curing process to the conductive material to form the conductive member
Implementation Method 2
The adhesive pattern layer is locating between the conductive layer structure and the core substrate, and bonding the conductive layer structure to the core substrate
Data Source
AI summary
An electronic device includes a core substrate, a conductive layer structure, an adhesive pattern layer, and a conductive member. The core substrate defines two opposite surfaces and has a through hole penetrating the two surfaces. The conductive layer structure is stacked over one side of the core substrate, at least partially covering one opening of the through hole. The adhesive pattern layer is disposed between the conductive layer structure and the core substrate, bonding the conductive layer structure to the core substrate; the adhesive pattern layer has an opening window exposing at least a portion of the conductive layer structure; the through hole and the opening window at least partially overlap in the projection direction. The conductive member is formed from a thermally cured conductive material, disposed in the through hole of the core substrate, with one end electrically connected to the conductive layer structure through the opening window.