Main Board Through-Hole Antenna Layout for Slim mmWave Devices
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Solution Overview
Problem
The increasing demand for wireless data traffic due to the widespread use of electronic devices has led to a challenge in accommodating larger wireless communication circuits and array antennas in slim electronic devices, where space constraints become a significant issue, especially for high-frequency bands like mmWave.
Innovation Solution
The solution involves a design where the antenna module is partially disposed in a through hole of the main board, with the wireless communication circuit electrically connected to the antenna elements on the board, allowing for efficient transmission and reception of signals in a predetermined frequency band, thereby reducing the overall space required.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the antenna module and wireless communication circuit are disposed on the main board, then the device can transmit and receive high-frequency signals, but the physical space required increases
Solution Approach 1:
The antenna module is nested within a through-hole of the main board, with the board at least partially disposed in the hole. This nesting structure allows the antenna elements to be positioned within the board's thickness rather than occupying additional planar space, effectively reducing the device's overall footprint while maintaining signal transmission capability.
Solution Approach 2:
The invention transitions from a two-dimensional arrangement (antenna on board surface) to a three-dimensional arrangement (antenna embedded in through-hole). By utilizing the vertical dimension and board thickness, the design accommodates the antenna module without increasing the device's planar area, thus resolving the space constraint.
2Length of stationary object
If electronic devices become slim, then the device profile is reduced, but it becomes difficult to secure space for arranging array antenna and wireless communication circuit
Solution Approach 1:
The antenna module and wireless communication circuit are nested within the main board's through-hole structure. This allows both components to be accommodated within the existing device thickness without requiring additional lateral space, enabling slim device profiles while maintaining necessary component placement.
Solution Approach 2:
The invention merges the antenna module and wireless communication circuit into a single integrated antenna module unit that is disposed within the main board. This consolidation reduces the total space required compared to separate arrangements, allowing both functions to coexist within the constrained thickness of slim devices.
Data Source
AI summary
Various embodiments of the disclosure relate to an electronic device including an antenna. The electronic device may include: a housing; a main board disposed in an internal space of the housing and including a first surface oriented in a first direction, a second surface facing a direction opposite the first direction, and a through hole; and an antenna module disposed on the main board. The antenna module may include: a board at least partially disposed in the through hole and including a plurality of antenna elements; and a wireless communication circuit configured to transmit and/or receive a wireless signal in a predetermined frequency band via the plurality of antenna elements, the wireless communication circuit disposed on the second surface of the main board.