Through-Hole Board Layout for Power and Control Circuit Isolation
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Solution Overview
Problem
The challenge is to downsize electronic devices while minimizing the adverse effects of heat and electrical noise generated by power circuits on control circuits, which are typically mounted on the same wiring board, leading to potential malfunctions and performance deterioration.
Innovation Solution
The solution involves arranging a power transistor on the back surface of a through-hole board with a control circuit on the front surface, using through-hole vias to electrically connect them, and incorporating a conductive member in some vias for thermal management, allowing for efficient heat dissipation and reduced noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the electronic device is downsized to reduce cost, then the external size is reduced, but heat from the power circuit is transmitted to the control circuit causing potential malfunction
Solution Approach 1:
The circuit board is divided into a front surface for mounting the control circuit and a back surface for mounting the power circuit. This spatial segmentation isolates the heat-generating power circuit from the heat-sensitive control circuit, allowing downsizing without heat transmission issues.
Solution Approach 2:
The patent transitions from a planar single-sided layout to a three-dimensional dual-sided layout. By utilizing the vertical dimension (front and back surfaces of the board), the design achieves compact footprint while maintaining thermal separation between power and control circuits.
2Volume of moving object
If the electronic device is downsized to reduce cost, then the external size is reduced, but electrical noises from the power circuit affect the control circuit
Solution Approach 1:
The circuit board is segmented into distinct functional zones: the front surface hosts the control circuit while the back surface hosts the power circuit. This segmentation creates physical isolation that reduces electrical noise interference from the power circuit to the control circuit.
Solution Approach 2:
The circuit board itself acts as an intermediary barrier between the power circuit and control circuit. By routing connections through controlled impedance traces and using the board structure as a shield, electrical noise from the power circuit is attenuated before reaching the control circuit.
3Device complexity
If the power circuit and control circuit are mounted on one board, then device complexity is reduced, but heat and noise from the power circuit cause performance deterioration
Solution Approach 1:
The unified device is segmented into two functional modules mounted on opposite surfaces: power circuit module on the back and control circuit module on the front. This segmentation maintains device integration while preventing performance deterioration through physical isolation of noise and heat sources.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the downsizing of electronic devices while maintaining performance by effectively managing heat and noise, thereby improving reliability and efficiency.
Implementation Method 1
the plurality of through hole vias include a first through hole via having a first size, a second through hole via which is larger than the first size and in which a cable can be inserted, and a third through hole via in which a conductive member is embedded
Data Source
AI summary
An electronic device is downsized while suppressing performance degradation of the electronic device. In the electronic device, a power module including a power transistor is arranged in a first region on a back surface of a through hole board having a plurality of through hole vias having different sizes while a pre-driver including a control circuit is arranged in a second region on a front surface of the board. In this case, in a plan view, the first region and the second region have an overlapping region. The power module and the pre-driver are electrically connected to each other via a through hole via. The plurality of through hole vias include a through hole via having a first size, a through hole via which is larger than the first size and in which a cable can be inserted, and a through hole via in which a conductive member is embedded.