Circuit Board Through-Hole Support Layout for Compact Shielding

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing image forming apparatuses require a large space for arranging circuit boards and support members due to the arrangement of the second shielding member outside the power supply substrate's outer periphery, necessitating a significant area for both components.

Innovation Solution

The image forming apparatus incorporates a circuit board with a through-hole that allows a support member to pass through, connecting to first and second members that support the circuit board, reducing the space required by integrating the support structure within the board's dimensions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If the second shielding member is arranged outside the outer periphery of the power supply substrate, then the shielding effect is improved, but the area occupied by the circuit board and support member increases

Engineering Contradiction:
Improveshielding effectVSAvoidarea occupied by circuit board and support member
Core Design Contradiction:
Object-affected harmful factorsVSArea of stationary object

Solution Approach 1:

The support member is inserted through a through-hole in the circuit board, with its ends nested within the areas surrounded by the outer peripheries of the first and second shielding members. This nesting arrangement allows the support member to be positioned within the existing boundary defined by the shielding members, eliminating the need for additional external space while maintaining structural support functionality.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The support member transitions from a conventional external arrangement to a through-hole penetration arrangement, utilizing the vertical dimension (passing through the circuit board thickness) to achieve support functionality without increasing the horizontal footprint. This dimensional transition allows the support structure to be integrated within the existing planar boundaries.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Strength

If the support member is positioned externally to the circuit board, then the support function is achieved, but the space required for arrangement increases

Engineering Contradiction:
Improvesupport functionVSAvoidspace required for arrangement
Core Design Contradiction:
StrengthVSArea of stationary object

Solution Approach 1:

The support member is merged with the circuit board structure by passing through its thickness, combining the support function with the existing board geometry. This integration allows the support member to utilize the vertical space already occupied by the circuit board rather than requiring separate external arrangement space, thereby maintaining support strength while reducing overall arrangement footprint.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The support member is nested within the vertical extent of the circuit board by passing through the through-hole, with its functional ends positioned within the areas surrounded by the outer peripheries of the shielding members. This nesting eliminates the need for external support structures that would increase the horizontal arrangement space.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Stability of the object's composition

If the circuit board and support member are arranged in conventional configuration, then the support function is provided, but the overall area increases

Engineering Contradiction:
Improvesupport functionVSAvoidoverall area
Core Design Contradiction:
Stability of the object's compositionVSArea of stationary object

Solution Approach 1:

The support member utilizes the vertical dimension by passing through the circuit board thickness, transitioning from a conventional external horizontal arrangement to a through-hole vertical penetration arrangement. This dimensional change enables the support function to be achieved within the existing horizontal boundaries, reducing the overall area occupied by the assembly.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The through-hole is pre-formed in the circuit board to accommodate the support member, allowing the support structure to be integrated during the assembly process. This preliminary preparation enables the support member to be positioned precisely within the boundary defined by the shielding members, ensuring both support functionality and compact arrangement from the outset.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS12566402B2Image forming apparatus for arranging circuit board
Publication Date: 2026.03.03 CANON KK
  • US12566402B2 patent drawing
  • US12566402B2 patent drawing
  • US12566402B2 patent drawing

AI summary

An image forming apparatus includes a circuit board, first and second members, and a support member. The circuit board includes a first surface and a second surface that is a back side of the first surface in a direction orthogonal to the first surface. The first member supports the circuit board and covers at least one portion of the first surface of the circuit board. The second member covers at least one portion of the second surface of the circuit board. The support member is connected to the first member and the second member and supports the first member and the second member. The circuit board has a through-hole that penetrates from the first surface to the second surface. The support member passes through the through-hole and is connected to the first member and the second member.