Through-Hole Vibration Element Bonding Without Resin-Induced Cracking
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Solution Overview
Problem
Existing vibration devices face issues with electrode film deformation and potential cracking due to the use of soft resin layers, which can lead to wire breakage when the vibration element is heated and pressurized.
Innovation Solution
A vibration device design that includes a semiconductor substrate with through holes, conductive layers, and organic resin formed on the side faces of the through holes, with wires and bonding members positioned in regions not overlapping the organic resin, ensuring robust electrical coupling and minimizing deformation risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resin layer is disposed between the wire and the inner wall of the through hole to reduce parasitic capacitance, then the parasitic capacitance is reduced, but the electrode film is deformed due to the soft resin layer during heating and pressurization, causing cracks and wire breakage
Solution Approach 1:
The patent applies local quality by creating a first region on the first face where the organic resin is NOT disposed, specifically around the opening of the first through hole. This localized modification allows the wire to be positioned in an area without resin, preventing the soft resin from deforming the electrode film during heating and pressurization, while still maintaining the beneficial parasitic capacitance reduction in other areas where the resin is present.
2Reliability
If a resin layer is used to reduce parasitic capacitance, then the electrical performance is improved, but the wire and electrode film become vulnerable to cracking and breakage during bonding
Solution Approach 1:
The patent segments the first face into different regions: a first region without organic resin where the wire is positioned, and other regions where the resin is present to reduce parasitic capacitance. This segmentation allows the wire to be protected from thermal and mechanical stress damage during bonding while maintaining the electrical performance benefits of the resin in other areas.
Solution Approach 2:
The first region acts as an intermediary zone that mediates between the conflicting requirements of having resin for parasitic capacitance reduction and avoiding resin for wire protection. By positioning the wire in this resin-free zone, the patent eliminates the harmful interaction between the soft resin and the wire/electrode film during heating and pressurization.
Data Source
AI summary
A vibration device includes a semiconductor substrate having a first face and a second face in a front-to-back relationship with the first face, the semiconductor substrate having a first through hole that extends from the first face to the second face, a first conductive layer disposed on the second face of the semiconductor substrate and overlapping the first through hole in plan view, an organic resin formed on a side face of the first through hole and the first face of the semiconductor substrate, the first face being located around an opening of the first through hole, the opening being close to the first face, a first wire formed on a surface of the first conductive layer, the surface being exposed from the first through hole, on a surface of the organic resin, and in a first region of the first face of the semiconductor substrate, the first region not overlapping the organic resin, and a vibration element bonded to a portion of the first wire, the portion being disposed in the first region, through a first bonding member.