Through-Hole Cavity Optical Device Lens Integration
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Solution Overview
Problem
The existing manufacturing processes for optical devices, such as LEDs and sensors, often result in reliability issues like delamination and air bubble trapping due to differences in thermal expansion and contraction of materials, and the complexity of integrating lenses, which affects optical efficiency and performance.
Innovation Solution
The use of a through-hole cavity design allows for a single-step molding process of the lens within the optical device, eliminating air bubble trapping and reducing manufacturing complexity by integrating the lens with the transparent encapsulant, which is cured in place, thus enhancing mechanical interlock and optical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the lens is attached utilizing glue, then the lens can be integrated into the optical device, but the lens may be detached when exposed to heat due to different thermal expansion and contraction properties
Solution Approach 1:
The patent merges the lens and the transparent encapsulant into a single integrated component formed through co-molding. The lens is not attached separately with glue but is formed as an integral part of the encapsulant structure, eliminating the interface between separate materials that causes thermal expansion mismatch and detachment issues.
Solution Approach 2:
The patent uses a single transparent encapsulant material that serves dual functions: as the encapsulant and as the lens material. This composite approach eliminates the need for separate lens and encapsulant materials with different thermal properties, thereby preventing thermal expansion-related detachment.
2Ease of manufacture
If the encapsulant is used to fill up a cavity or a reflector cup, then the cavity can be sealed, but air bubbles might be trapped inside the device
Solution Approach 1:
The patent segments the molding process into two distinct phases: first forming the body and reflector cup, then separately forming the transparent encapsulant with the lens in a second molding step. This segmentation allows air bubbles to escape during the first phase and prevents trapping during the second phase when the encapsulant is cured in place.
Solution Approach 2:
The patent performs preliminary actions by first forming the body structure and reflector cup, then preparing the mold cavity for the second molding step. This preliminary preparation ensures that the mold is properly configured to allow complete filling and curing of the transparent encapsulant without air bubble entrapment.
3Ease of manufacture
If a thin layer of air is trapped in the gluing process, then the lens can be attached, but the optical property of the devices deteriorates
Solution Approach 1:
The patent merges the lens and encapsulant into a single co-molded component, eliminating the gluing process entirely. This integration removes the air layer that would otherwise be trapped between the lens and encapsulant, preserving optical properties while maintaining ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the reliability and optical efficiency of optical devices by ensuring a seamless integration of the lens, reducing manufacturing steps, and minimizing the risk of air bubbles and thermal detachment issues, leading to enhanced performance and cost-effectiveness.
Implementation Method 1
The encapsulant used to form the lens is made from liquid or semi-liquid form before being cured into solid form
Data Source
AI summary
A light-emitting device having a through-hole cavity is disclosed. The optical device may contain a plurality of conductors, a light source die, a body and a transparent encapsulant material. The body may have a top surface and a bottom surface. A cavity is formed within the body extending from the bottom surface to the top surface and defining therein a bottom opening and a top opening, respectively. Optionally, the light-emitting device may comprise a lens. During manufacturing process, liquid or semi-liquid form transparent material is injected from the bottom surface into the cavity, encapsulating the light source die and forming a lens. The shape of the lens is defined by a mold aligned to the top opening of the body. In yet another embodiment, optical devices having a cavity or multiple cavities are disclosed. The optical devices may include a proximity sensor, an opto-coupler, an encoder and other similar sensors.