Through-Hole Conductor Layout to Prevent Air Bubbles in Displays
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Solution Overview
Problem
Existing electronic devices face issues with air bubbles forming in conductors due to poor contact between conductive elements, leading to electrical abnormalities and poor display quality, and require a narrow frame design that maximizes display area.
Innovation Solution
The electronic device incorporates a through hole partially surrounded by a conductive element, allowing the conductor to fill only a portion of the hole with a space separating its side wall from the hole's side wall, preventing air bubble formation and ensuring reliable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the conductor completely fills the through hole to ensure good electrical connection, then electrical conductivity is improved, but air bubbles are trapped inside causing electrical abnormalities
Solution Approach 1:
The through hole is divided into two functional zones: a lower filling portion that receives the conductor for electrical connection, and an upper empty portion that serves as an air bubble escape channel. This segmentation allows the conductor to fill only part of the hole, preventing air bubble entrapment while maintaining electrical conductivity.
Solution Approach 2:
The harmful air bubbles are extracted from the conductor formation process by providing a dedicated escape path through the upper portion of the through hole. The conductor is taken out from completely filling the hole, leaving the upper portion empty specifically for air bubble removal.
2Area of stationary object
If electronic components are placed on the front side of the substrate, then electrical connections are straightforward, but the peripheral usage rate increases reducing display area
Solution Approach 1:
The through hole provides a vertical dimension for electrical connections, allowing conductors to pass through the substrate thickness direction. This enables electronic components to be placed on the back side of the substrate, utilizing the Z-dimension for connections rather than consuming lateral display area.
Data Source
AI summary
An electronic device including a first conductive element, a second conductive element, a substrate, and a conductor is provided. The first conductive element has a first region. The substrate has a through hole. The first through hole is disposed between the first conductive element and the second conductive element. The conductor electrically connects the first conductive element to the second conductive element through the through hole. The through hole is partially surrounded by the first region.