Electronic device and method for manufacturing the same
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Solution Overview
Problem
The increasing aspect ratio of conductive vias in semiconductor packaging poses challenges to reliability due to defects such as voids, which affect the resistivity of conductive elements in electronic devices.
Innovation Solution
A repair process is implemented to identify and address defect regions in conductive elements within through holes, forming a conductive element with a first portion having protrusions and recesses, and a second portion disposed in the recesses, enhancing the reliability of the electronic device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the aspect ratio of conductive vias is increased to accommodate higher density mounting, then the device density is improved, but the reliability of conductive elements deteriorates due to defects such as voids
Solution Approach 1:
The conductive element is divided into a first portion and a second portion, where the first portion is formed initially and the second portion is formed subsequently to repair defects. This segmentation allows the conductive element to be constructed in stages, enabling defect identification and repair while maintaining the overall continuity and functionality of the conductive path.
Solution Approach 2:
The first portion of the conductive element is formed in advance before final completion. This preliminary formation allows for inspection and identification of defect regions (such as voids) before the conductive element is fully completed, enabling proactive defect repair rather than reactive correction after full formation.
Solution Approach 3:
The surface morphology of the first portion is modified to include protrusions and recesses, changing the physical parameters of the conductive element surface. This parameter change increases the surface area and provides anchoring points for the second portion, improving adhesion and ensuring reliable electrical connection while compensating for defects in the first portion.
2Ease of manufacture
If conventional conductive via formation is used, then the manufacturing process is simple, but defects such as voids cause increased resistivity
Solution Approach 1:
The manufacturing process incorporates inspection and identification steps that provide feedback on the quality of the first portion of the conductive element. Defect regions are detected and identified, and this information feeds back into the process to guide the formation of the second portion, ensuring that repairs are targeted precisely at the defective areas rather than requiring complete reformation.
Solution Approach 2:
The process allows for the effective discarding of defective portions (in terms of electrical functionality) by forming a new second portion that bypasses or repairs the defects. The original first portion is not completely discarded but is enhanced and supplemented by the second portion, recovering the intended conductive function despite the presence of initial defects.
Data Source
AI summary
The present disclosure provides an electronic device and a method for manufacturing the same. The electronic device includes a first transparent substrate, a conductive element, a circuit structure, and an electronic unit. The first transparent substrate has a plurality of through holes. The conductive element is disposed in at least one of the plurality of through holes, wherein the conductive element includes a first portion and a second portion surrounded by the second portion. The circuit structure is disposed on the first transparent substrate. The electronic unit is disposed on the circuit structure and is electrically connected to the conductive element through the circuit structure. The surface of the first portion of the conductive element has a plurality of recesses, and at least one portion of the second portion of the conductive element is disposed in at least one of the plurality of recesses.