Through-Hole Electrical Connection Structure for Miniaturized Displays
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Solution Overview
Problem
Existing electronic devices face challenges in achieving reliable and efficient electrical connections due to the need for miniaturization of electrical connection structures, which affects their conduction capability and process yield.
Innovation Solution
The electronic device incorporates a specific electrical connection structure comprising a first substrate, first and second conductive pads, through-holes, and conductive materials, allowing for reduced volume and depth of through-holes, improved conductive material filling, and enhanced reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the size of the electrical connection structure is miniaturized to meet higher resolution requirements, then the display quality is improved, but the reliability and conduction capability of the electrical connection structure deteriorates
Solution Approach 1:
The patent implements nesting by placing the first conductive material inside the through-hole and the second conductive material on top of it, creating a nested structure where conductive elements are embedded within each other. This nested arrangement increases the effective conduction path area without increasing the overall footprint, thereby maintaining reliability while enabling miniaturization of the electrical connection structure
Solution Approach 2:
The patent transitions from a single-layer conductive structure to a multi-dimensional structure by adding vertical stacking of conductive materials (first conductive material within the through-hole and second conductive material on top). This dimensional change allows the electrical connection to utilize both horizontal and vertical space, increasing conduction capability without expanding the lateral size, thus supporting miniaturization while maintaining reliability
2Illumination intensity
If the size of the electrical connection structure is miniaturized to meet higher resolution requirements, then the display quality is improved, but the conduction capability of the electrical connection structure deteriorates
Solution Approach 1:
The nested configuration of conductive materials within the through-hole creates multiple conductive pathways in a compact space. The first conductive material fills the through-hole while the second conductive material sits on top, forming a nested arrangement that increases the effective conduction cross-section without increasing the overall structure size, thereby maintaining conduction capability during miniaturization
Solution Approach 2:
The patent employs composite conductive structures by combining different conductive materials (first conductive material and second conductive material) with different properties. This composite approach allows optimization of conduction capability through material selection while maintaining a miniaturized structure, as each material can be chosen for specific electrical properties that complement each other
3Ease of manufacture
If traditional electrical connection structures are used, then manufacturing is simpler, but process yield deteriorates due to miniaturization requirements
Solution Approach 1:
The patent applies preliminary action by pre-forming the through-hole with the first conductive material inside it before adding the second conductive material on top. This sequential pre-preparation of conductive layers ensures proper alignment and filling, reducing manufacturing defects and improving process yield while maintaining compatibility with existing fabrication processes
Data Source
AI summary
An electronic device is provided. The electronic device includes at least one electrical connection structure. The at least one electrical connection structure includes a first substrate, a first conductive pad, a second substrate, a second conductive pad, a first conductive material, a through-hole, and a second conductive material. The first conductive pad is disposed on the first substrate and has a top surface and a side surface. The second conductive pad is disposed on the second substrate. The first conductive material is disposed on the second conductive pad. The through-hole passes through the first conductive pad and the first substrate. The second conductive material is partially disposed within the through-hole and is at least partially in contact with the top surface and the side surface of the first conductive pad, and the first conductive material.