Through-Hole Electrical Connection Structure for Slim Border Devices
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Solution Overview
Problem
Existing electrical connection structures for electronic devices face challenges in achieving reliable and efficient connections between substrates, often resulting in complex designs and increased border sizes due to insufficient contact lengths and reliability issues.
Innovation Solution
The proposed electrical connection structure includes a through hole penetrating a first substrate to expose a part of a second conductive pad, with a conductive material partially disposed within, featuring a narrowest portion and a contact portion that extends beyond the narrowest portion, enhancing contact length and reliability, and optionally incorporating through hole wide portions to increase contact area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electrical connection structures are used, then the connection between substrates can be established, but the contact length between conductive pads and conductive material is insufficient, resulting in poor electrical reliability
Solution Approach 1:
The through-hole is designed with a three-dimensional structure that extends through the first substrate, allowing the conductive material to make contact with the second conductive pad at a different spatial level. This vertical dimensionality change enables extended contact length without increasing planar complexity, directly resolving the contradiction between reliability and device complexity.
Solution Approach 2:
The conductive material is pre-filled into the through-hole before final assembly, ensuring that the contact interface between the conductive material and the second conductive pad is established in advance. This preliminary action guarantees sufficient contact length and improves electrical connection reliability while maintaining simple device structure.
2Ease of operation
If conventional connection structures are used, then substrates can be connected, but the electrical conduction path between substrates is lengthy, complicating peripheral design
Solution Approach 1:
The electrical conduction path is redirected from a planar route to a vertical three-dimensional path through the through-hole. This dimensional change shortens the conduction distance between substrates and simplifies peripheral design by eliminating the need for lengthy lateral connections.
3Reliability
If the contact area between conductive pad and conductive material is increased, then electrical reliability improves, but the device border size increases
Solution Approach 1:
The contact area is expanded vertically through the through-hole structure rather than horizontally at the surface. This allows the conductive material to extend deeper into the substrate, increasing contact area and reliability without increasing the device's planar border size.
Solution Approach 2:
The through-hole creates a porous or cavity structure within the substrate that accommodates the conductive material. This internal porosity enables increased contact area between the conductive material and conductive pad without requiring additional external space, thus maintaining compact device dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively shortens the electrical conduction path between substrates, simplifies peripheral designs, and improves the success rate of connections, enabling a slim border or borderless design with enhanced electrical reliability.
Implementation Method 1
the conductive material is partially disposed in the through hole, so that the first substrate and the second substrate have an electrical conduction path
Data Source
AI summary
Disclosed are an electrical connection structure and an electronic device including the same. The electrical connection structure includes a first substrate, a first conductive pad, a second substrate, a second conductive pad, a through hole, and a conductive material is provided. The first conductive pad is disposed on the first substrate. The first conductive pad includes a first upper surface. The second conductive pad is disposed on the second substrate. The second conductive pad includes a second upper surface. The through hole penetrates the first substrate and exposes a part of the second upper surface. The conductive material is partially disposed in the through hole. The conductive material includes a narrowest portion and a first contact portion in contact with the second upper surface. A length of the first contact portion is greater than a length of the narrowest portion in a cross-sectional view.