Through-Hole Electrode Substrate for Image Sensor Alignment
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Solution Overview
Problem
The assembly of optical systems in solid-state imaging devices for mobile electronic devices is complicated due to the need for precise alignment of the optical axis and the light receiving surface, often resulting in misalignment and image formation issues.
Innovation Solution
An image sensor module with a light-transmissive interposer substrate having through-holes for electrodes and support columns, allowing for precise alignment of the image sensor and lens unit, and incorporating a light absorption layer and reflection preventive layers to enhance image quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a glass epoxy substrate is used as the substrate, then the substrate provides structural support, but the flatness of the surface is insufficient requiring complicated alignment processes
Solution Approach 1:
The patent introduces a light-transmissive substrate as an intermediary component between the image sensor and the glass epoxy substrate. This light-transmissive substrate has a highly flat surface that serves as the reference plane for mounting both the image sensor and lens unit, while the glass epoxy substrate provides the overall structural support. The intermediary substrate decouples the structural support function from the precision reference surface function, eliminating the need for complicated alignment processes.
2Manufacturing precision
If complicated alignment processes are used to ensure flatness, then the light receiving surface and optical axis can be aligned, but the assembly process becomes complex and time-consuming
Solution Approach 1:
The light-transmissive substrate is pre-manufactured with a highly flat surface that serves as the reference plane. This preliminary preparation of the reference surface eliminates the need for complicated alignment processes during assembly. The image sensor and lens unit can be directly mounted on this pre-prepared flat surface, significantly simplifying the assembly process while maintaining high alignment precision.
Solution Approach 2:
The light-transmissive substrate acts as an intermediary reference plane that decouples the precision alignment requirement from the structural support function. By providing a pre-manufactured flat surface, it serves as a mediator that enables simple assembly processes while achieving high alignment precision between the image sensor and optical system.
3Manufacturing precision
If the substrate surface is made highly flat, then alignment is simplified, but the structural support capability may be compromised
Solution Approach 1:
The patent segments the substrate system into two separate components: a light-transmissive substrate and a glass epoxy substrate. The light-transmissive substrate is dedicated to providing the highly flat reference surface for precision alignment, while the glass epoxy substrate is dedicated to providing structural support. This segmentation allows each component to optimize its specific function without compromising the other.
Solution Approach 2:
The light-transmissive substrate serves as an intermediary reference plane that provides high surface flatness without needing to bear the full structural load. The glass epoxy substrate provides the primary structural support, while the intermediary light-transmissive substrate provides the precision reference surface, allowing both functions to be fulfilled simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy and precise assembly of the optical system, ensuring accurate alignment of the optical axis and light receiving surface, resulting in uniform image formation across the sensor's effective region.
Implementation Method 1
an interposer substrate having a first surface and a second surface opposite to the first surface, the interposer substrate being light-transmissive
Implementation Method 2
an image sensor located to face the first surface of the interposer substrate, the image sensor having a light receiving surface on a side of the interposer substrate, a plurality of photoelectric conversion elements being located at the light receiving surface
Data Source
AI summary
An image sensor module includes an interposer substrate having a first surface and a second surface opposite to the first surface, the interposer substrate being light-transmissive and having a plurality of through-holes; an image sensor located to face the first surface of the interposer substrate, the image sensor having a light receiving surface on a side of the interposer substrate, a plurality of photoelectric conversion elements being located at the light receiving surface, the image sensor being connected with an external circuit via electrodes provided in the plurality of through-holes; and a lens unit located to face the second surface of the interposer substrate.