Through-Hole Insertion Seal for Heat-Dissipating Electronic Housings
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Solution Overview
Problem
Existing electronic devices face challenges in achieving both effective heat dissipation and sealing reliability due to loose connections at through holes, leading to potential leakage and reduced operation performance.
Innovation Solution
The implementation of an insertion connection structure with groove and insertion portions between the housing and predetermined structures at through holes, ensuring a complete sealing surface and reducing leakage paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If external structures (radiator assembly, inductor assembly) are arranged outside the housing structure through through holes for heat dissipation, then heat dissipation performance is improved, but sealing reliability deteriorates due to loose connections at the through holes
Solution Approach 1:
The connection structure is divided into multiple segments: the groove portion formed on the housing structure and the insertion portion on the external structure. This segmentation allows for a more precise fit and better sealing at the through hole connection, resolving the contradiction between heat dissipation and sealing reliability.
Solution Approach 2:
The groove portion is specifically designed to surround the through hole, creating a localized sealing region. This local quality enhancement ensures that the connection area has superior sealing properties while the rest of the structure maintains its heat dissipation function.
2Ease of manufacture
If external structures are loosely connected at through holes due to manufacturing and mounting errors, then ease of manufacture is improved, but sealing reliability deteriorates leading to leakage risk
Solution Approach 1:
The insertion connection structure provides a degree of flexibility and adjustment during assembly. The groove and insertion portion design allows for self-alignment and compensation of manufacturing tolerances, maintaining sealing reliability while preserving ease of manufacture.
Solution Approach 2:
The groove portion dimensions and shape are specifically designed to accommodate manufacturing variations. By optimizing the geometric parameters of the groove and insertion portion, the structure tolerates mounting errors while maintaining effective sealing.
Data Source
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AI summary
An electronic device and an electrical power system are provided, which relate to the technical field of electrical technology. The electronic device includes a housing structure, a predetermined structure, and at least one insertion connection structure. The housing structure is provided with a through hole, and the predetermined structure is correspondingly arranged at the through hole and is exposed outside the housing structure. The predetermined structure is attached to a predetermined side of the housing structure along a depth direction of the through hole to form an attaching surface surrounding the through hole, and the at least one insertion connection structure is provided between the predetermined structure and the housing structure at the attaching surface. The at least one insertion connection structure includes a groove portion and an insertion portion that are respectively provided on the predetermined structure and the housing structure, the groove portion is connected to the insertion portion by insertion, and the groove portion surrounds the through hole. The sealing between the housing structure and the predetermined structure of the electronic device can be realized without a sealing ring, and both the heat dissipation requirement and the sealing reliability requirement of the electronic device can be satisfied.