Through-Hole Interconnection for Opposite-Side Substrate Tracks
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Solution Overview
Problem
Existing methods for creating electrically conductive connections between tracks on opposite sides of a dielectric substrate, such as in RFIDs, are inefficient and unreliable, particularly for mass production, due to high processing steps, material costs, and precision requirements.
Innovation Solution
A method involving piercing through holes in the substrate to connect tracks, allowing for electrolytic growth and thickening of the conductive material, with anode and cathode placement for accelerated ion deposition, enabling efficient and reliable connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a dielectric bridge with conductive connection is used to interconnect tracks on opposite sides of a substrate, then electrical connection is achieved, but the method requires multiple separate processing steps and substrate manipulation which reduces productivity and increases manufacturing complexity
Solution Approach 1:
The invention combines multiple processing steps into a single integrated through-hole formation process. The through-hole is created in one operation that simultaneously penetrates the substrate and establishes the conductive path, eliminating the need for separate bridge formation, alignment, and connection steps required by prior art methods.
Solution Approach 2:
The through-hole structure serves multiple functions simultaneously: it provides mechanical support, establishes electrical connection, and defines the precise alignment between tracks on opposite sides. This multi-functional approach replaces the multiple specialized components and steps required by conventional dielectric bridge methods.
2Reliability
If a conductive ink is used to fill holes for creating electrical connections, then connection is achieved, but the high cost of conductive ink and the precision requirements for alignment reduce ease of manufacture and increase device complexity
Solution Approach 1:
The conductive material in the through-hole serves dual purposes: it provides the electrical connection and simultaneously reinforces the mechanical structure. The same material that establishes conductivity also strengthens the hole walls, eliminating the need for separate reinforcement structures and simplifying the manufacturing process.
Solution Approach 2:
The invention changes the physical and chemical parameters of the conductive material by allowing it to grow electrolytically within the through-hole. This electrolytic growth process enables precise control of the conductive material's properties and automatically achieves the required alignment without high-precision positioning equipment.
3Reliability
If cuts are made in the substrate at angles to bring tracks into contact, then connection is achieved, but the connection reliability is poor and the cut occupies significant space on the substrate
Solution Approach 1:
The invention transitions from planar track connections to three-dimensional through-hole connections. By creating vertical pathways through the substrate, the method achieves reliable electrical connection without requiring large lateral space, unlike angular cuts that consume significant substrate area.
Solution Approach 2:
The through-hole provides localized reinforcement and precise alignment at the connection point. The conductive material is concentrated exactly where needed within the hole, creating a focused, high-reliability connection without requiring extensive modifications to the surrounding substrate structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method facilitates efficient and reliable electrically conductive connections between tracks, suitable for mass production, reducing material costs and processing complexity while ensuring high connection reliability.
Implementation Method 1
causing an electrically conductive material to grow electrolytically from a first track, via the through hole, to a second track in an electrolytic bath
Implementation Method 2
an electrically conductive connection is obtained by causing an electrically conductive material to grow electrolytically from a first track, via the through hole, to a second track in an electrolytic bath
Implementation Method 3
with anode and cathode placement for accelerated ion deposition
Data Source
AI summary
A method and device for making an electrically conductive connection between two electrically conductive tracks present on two opposite sides of a dielectric substrate. The method: a) provides the substrate, with at least one first electrically conductive track present on one side thereof and at least one second electrically conductive track present on the other side of the substrate opposite the one side, b) forms a through hole through the substrate and through two opposite parts of a first track and a second track, respectively, and c) makes an electrically conductive connection via the through hole between the first track through which the through hole has been formed and the second hole through which the through hole has been formed.