Through-Hole Display Device Structure for Functional Layer Separation
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Solution Overview
Problem
The challenge in organic EL display devices is forming a common functional layer separately in the display area and through hole side without increasing manufacturing costs, as existing methods like using a reverse-tapered structural body require negative photosensitive materials.
Innovation Solution
A display device with a resin substrate layer and thin film transistor layer, featuring inner protrusions surrounding a through hole, where the underlying inorganic insulation layer projects like an eave to allow separate formation of the common functional layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a reverse-tapered structural body is used to form the common functional layer separately in the display area and through hole side, then the common functional layer can be formed separately, but the manufacturing cost increases due to requiring negative photosensitive material
Solution Approach 1:
The non-display area is divided into multiple independent protrusions surrounding the through hole, with each protrusion having its own underlying inorganic insulation layer that projects like an eave. This segmentation allows the common functional layer to be formed separately on each protrusion without requiring complex negative photosensitive materials, thereby reducing manufacturing cost while achieving separate formation.
Solution Approach 2:
The underlying inorganic insulation layer that projects like an eave from the underlying resin layer serves as an intermediary structure. It provides a physical barrier and separation surface that enables the common functional layer to be formed separately on the display area side and through hole side without direct contact, eliminating the need for negative photosensitive materials and reducing manufacturing complexity.
2Adaptability or versatility
If a through hole is provided inside the display area to install electronic components, then electronic components can be installed, but water may flow into the display area through the common functional layer exposed from the through hole causing deterioration
Solution Approach 1:
The underlying inorganic insulation layer that projects like an eave from the underlying resin layer acts as a protective barrier. This thin film structure extends over the through hole and prevents water from flowing into the display area through the common functional layer, while still allowing the through hole to remain open for electronic component installation.
Solution Approach 2:
The eave-like projection of the underlying inorganic insulation layer is formed in advance before the common functional layer is deposited. This preliminary protective structure prevents water ingress before it can reach and damage the common functional layer and organic EL layer, thereby protecting the device integrity while maintaining the through hole functionality.
Data Source
AI summary
A plurality of inner protrusions are provided in a non-display area so as to surround a through hole. Each of the plurality of inner protrusions includes: an underlying resin layer; and an underlying inorganic insulation layer provided on the underlying resin layer. Each underlying resin layer is separated by a plurality of inner slits formed on a surface of a resin substrate layer so as to surround the through hole. The underlying inorganic insulation layer is provided so as to project like an eave from the underlying resin layer to either one or both of a through hole side and a display area side.