Substrate Through-Hole Layout for Protected Alignment Marks
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Solution Overview
Problem
The etching process during the formation of through holes in substrate materials damages or blurs alignment marks, making them difficult to identify, which affects the reliability and yield of electronic devices.
Innovation Solution
The electronic device design includes a through hole penetrating the substrate with a mark positioned between its surfaces, and a method involving laser modification and controlled etching steps to form the mark and hole, ensuring the mark is protected from damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If an etching process is used to form through holes in the substrate, then the through hole formation is achieved, but the alignment marks on the substrate surface are damaged or blurred
Solution Approach 1:
The patent applies preliminary action by forming the alignment marks on the substrate before the etching process that creates through holes. This sequential arrangement ensures that marks are already in place and can be properly positioned relative to the through holes, while the etching process can proceed without needing to create the marks during or after etching, thus avoiding mark damage.
Solution Approach 2:
The patent segments the substrate processing into distinct regions: mark formation areas and through hole etching areas. By spatially separating the mark locations from the through hole locations, the etching process can remove material to form through holes without directly affecting the integrity and visibility of the alignment marks in separate regions.
2Ease of operation
If marks are placed on the substrate surface for alignment, then alignment function is provided, but the marks are vulnerable to damage during subsequent etching processes
Solution Approach 1:
The alignment marks are formed in advance on the substrate before the etching process begins. This preliminary formation allows the marks to serve their alignment function throughout subsequent processing steps, including etching, without being created during or after the harmful etching process that could damage them.
Solution Approach 2:
The substrate is segmented into distinct functional zones where alignment marks are positioned in specific regions that are spatially separated from the through hole etching regions. This segmentation protects the marks from direct exposure to the etching process while still allowing them to perform their alignment function for the overall device fabrication.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances mark maintenance and recognition, improving the process yield and reliability of electronic devices by reducing the risk of mark damage during etching.
Implementation Method 1
performing a first modification step on a first region of the substrate, and performing a second modification step on a second region of the substrate... After performing the etching step, a through hole is formed in the first region and at least one mark is formed in the second region
Data Source
AI summary
An electronic device is provided. The electronic device includes a substrate, a through hole, a circuit structure, at least one electronic unit and at least one mark. The substrate has a first surface and a second surface opposite to the first surface. The through hole penetrates the substrate, and a side wall of the through hole connect the first surface and the second surface. The circuit structure is disposed on the substrate. The at least one electronic unit is disposed on the circuit structure and is electrically connected to the circuit structure. Moreover, the at least one mark is disposed between the first surface and the second surface. A method of manufacturing an electronic device is also provided.