Through-Hole Electronic Component Package for Low-Profile Mounting
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Solution Overview
Problem
Conventional electronic component packages face challenges in reducing size and height due to the presence of wiring boards, which increase the distance between terminal electrodes, leading to potential solder short circuits and height issues, especially when mounting components on motherboards.
Innovation Solution
The solution involves an electronic component package with a wiring board having through holes and conductor vias, where columnar terminals like solder bumps or conductor pillars are inserted from one surface to expose on the other, allowing direct connection to the motherboard without intermediate lands, and planar terminals are directly connected to conductor vias, reducing the package's size and height while enhancing heat dissipation and positional accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wiring board is used to mount electronic components, then components can be electrically connected and sealed, but the height of the package increases and the distance between terminal electrodes increases
Solution Approach 1:
The patent transitions from a conventional planar wiring board structure to a three-dimensional stacked structure where multiple wiring boards are layered and connected through through-holes. This dimensional change allows electrical connections to be established vertically through the stack, reducing the overall package height while maintaining reliable electrical connectivity between components on different layers.
Solution Approach 2:
The patent implements a nested structure where multiple wiring boards are stacked and integrated within a compact volume. Through-holes penetrate through the wiring boards to create vertical electrical pathways, allowing components on different layers to be connected without increasing the horizontal footprint significantly. This nesting approach enables high-density mounting while controlling package dimensions.
2Volume of moving object
If the space between terminal electrodes is narrowed for downsizing, then package size is reduced, but the possibility of solder short circuit between bump and electrode increases
Solution Approach 1:
The patent introduces an intermediary structure consisting of through-holes that extend through the wiring board, providing a controlled pathway for columnar terminals. These through-holes act as mechanical and electrical intermediaries between components on opposite sides of the wiring board, enabling narrow spacing between terminal electrodes while preventing solder short circuits through proper structural control and isolation.
Solution Approach 2:
The patent applies local quality by providing through-holes at specific locations where columnar terminals need to pass through, rather than uniformly across the entire wiring board. This localized approach allows narrow spacing between terminal electrodes at critical connection points while maintaining sufficient spacing elsewhere to prevent solder short circuits, thus optimizing both package size and bonding reliability.
3Reliability
If lands are provided on both surfaces of the wiring board for connection, then electrical connectivity is improved, but the distance between connection terminal and mother board increases
Solution Approach 1:
The patent segments the electrical connection path into multiple sections: columnar terminals on the first surface, through-holes penetrating the wiring board, and connection points on the second surface. This segmentation allows the connection to be established more directly to the mother board by eliminating unnecessary intermediate lands, thereby reducing the overall distance while maintaining reliable electrical connectivity through the distributed connection points.
Data Source
AI summary
The present disclosure is directed to an electronic component package including: a wiring board including a first principal surface and a second principal surface facing each other; an electronic component mounted on the first principal surface; a sealing member provided on the first principal surface for covering the electronic component; and a shield film provided on a surface of the sealing member, wherein the wiring board is provided with a plurality of through holes between the first principal surface and the second principal surface, an electronic component including a columnar terminal is mounted on the first principal surface, and the columnar terminal is inserted into at least one of the through holes from the first principal surface and is exposed on a side of the second principal surface, thereby reducing the size and height of the package.