Through-Hole Package Structure for High-Frequency Signal Routing
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Solution Overview
Problem
Window ball grid array (WBGA) packages struggle to transmit high-frequency signals due to the limitations of the wire-bonding process used for electrical connections.
Innovation Solution
A package structure is designed with substrates featuring patterned circuit layers and through holes, allowing for electrical connections through extending portions of the circuit layers beyond the substrate sidewalls, enabling direct connections between electronic components and facilitating high-frequency signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wire-bonding process is used for electrical connection, then manufacturing cost is reduced, but high-frequency signal transmission capability is lost
Solution Approach 1:
The patent extracts the wire-bonding process from the electrical connection method and replaces it with direct pad-to-pad contact through extending circuit layers. This eliminates the intermediate bonding wires while maintaining electrical connection functionality, thereby enabling high-frequency signal transmission without incurring the costs and limitations of wire-bonding processes.
Solution Approach 2:
The patent replaces the mechanical wire-bonding system with a direct electrical contact system using extending circuit layers. The mechanical bonding wires are substituted by conductive circuit traces that extend beyond substrate edges to contact pads on adjacent substrates, eliminating mechanical constraints and enabling high-frequency operation.
2Reliability
If extending portions of circuit layers are used for electrical connection, then high-frequency signal transmission is enabled, but device complexity increases
Solution Approach 1:
The patent merges the circuit layer with the substrate structure, where the circuit layer extends continuously from the substrate interior to the exterior edges. This integration eliminates the need for separate connection structures, reducing overall device complexity while enabling direct electrical contact for high-frequency signal transmission.
Solution Approach 2:
The extending circuit layers serve multiple functions: they provide electrical connection pathways, act as signal transmission lines, and establish mechanical alignment between substrates. This multi-functionality reduces the need for additional specialized components, thereby simplifying the overall device structure while enabling high-frequency operation.
Data Source
AI summary
A package structure and a method of manufacturing a package structure are provided. The package structure includes a first substrate, a first electronic component, a second substrate and a second electronic component. The first electronic component is disposed over a first through hole of the first substrate. The first electronic component is electrically connected to a first patterned circuit layer of the first substrate through an extending portion of the first patterned circuit layer extending beyond a sidewall of the first through hole. The second electronic component is disposed over a second through hole of the second substrate. The second electronic component is electrically connected to a second patterned circuit layer of the second substrate through an inner extending portion of the second patterned circuit layer extending beyond a sidewall of the second through hole.