Hybrid-Pitch Through-Hole Connector Layout for Lower Crosstalk

The patent applies local quality by creating different pitch configurations in different regions of the connector. Specifically, signal pins have different pitch distances from adjacent ground pins, creating localized variations in the electromagnetic field distribution. This non-uniform pitch structure optimizes the shielding effect at specific locations where crosstalk is most problematic, while maintaining the overall through-hole connector architecture for reliability and cost benefits.

The patent applies parameter changes by modifying the pitch parameters of the connector pins. By varying the pitch distances between signal pins and ground pins in specific patterns, the electromagnetic characteristics of the through-hole connector are altered to reduce crosstalk. This allows the through-hole technology to achieve performance levels previously associated with surface-mount technology, while retaining the manufacturing and reliability advantages of through-hole construction.

The patent applies asymmetry by introducing non-uniform pitch distances between pins. Specifically, signal pins are positioned at different pitch distances from their adjacent ground pins, creating an asymmetric pattern that optimizes electromagnetic shielding. This asymmetric configuration reduces crosstalk by creating more effective ground shielding zones near signal pins, while the overall manufacturing process remains relatively simple by maintaining regular patterns in other aspects of the connector design.