Through-Hole Pixel Layout With Encapsulation for Flexible Displays
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Solution Overview
Problem
Existing display devices face challenges in achieving both flexibility and durability, limiting their ability to enhance user experience through bending and folding.
Innovation Solution
A display device design featuring a substrate with through parts and an encapsulation layer that includes alternating organic and inorganic layers, along with specific inner surface configurations and wiring arrangements, enhances durability and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If the display device uses a thin profile design, then the device achieves light weight and modern aesthetics, but the durability and resistance to bending/folding are compromised
Solution Approach 1:
The encapsulation layer is divided into multiple sub-layers including inorganic layers (first and second inorganic encapsulation layers) and organic layers (first and second organic encapsulation layers). This segmented multi-layer structure provides enhanced protection against moisture and oxygen ingress while maintaining the thin profile of the display device, thereby improving durability without sacrificing weight advantages.
Solution Approach 2:
The encapsulation system employs composite materials combining inorganic encapsulation layers with organic encapsulation layers. The inorganic layers provide barrier properties against moisture and oxygen, while the organic layers provide flexibility and stress relief. This composite structure enables the thin display device to maintain both light weight and improved durability through complementary material properties.
2Reliability
If the encapsulation layer completely covers the through part, then moisture ingress is prevented, but the manufacturing complexity increases
Solution Approach 1:
The encapsulation layers are strategically positioned to cover critical areas where moisture ingress would occur most readily, such as the sides and top surface of the through part, while leaving the bottom surface partially exposed. This localized quality approach provides effective moisture protection at the most vulnerable points without requiring complete coverage, thereby reducing manufacturing complexity while maintaining reliability.
3Ease of manufacture
If wiring is arranged to overlap the through part, then routing is simplified, but moisture protection is compromised
Solution Approach 1:
The wiring is routed in a planar dimension parallel to the substrate surface, positioned adjacent to but not overlapping the through part. The encapsulation layers extend vertically to cover the through part's exposed surfaces. This dimensional separation allows simplified wiring routing in the horizontal plane while the vertical extension of encapsulation layers provides moisture protection, resolving the conflict between routing simplicity and protection effectiveness.
Data Source
AI summary
A display device and a method of manufacturing the same are disclosed. In one aspect, the display device includes a substrate including a separation area and a plurality of pixel formed over the substrate. The separation area is formed between adjacent pixels, and a plurality of through holes are respectively defined by a plurality of surrounding inner surfaces of the separation area, and wherein each of the inner surfaces passes through the substrate. The display device also includes an encapsulation layer formed over the substrate and covering the inner surfaces of the separation area.