Through-Hole Semiconductor Package for Dual-Side Cooling and Inspection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional VLSI component mounting techniques on PCBs are prone to mechanical damage from thermal expansion and flexural stresses, making them unreliable and difficult to inspect, and limit cooling options, as connection points are mostly located underneath the package or socket.
Innovation Solution
A semiconductor package is mounted within a through hole of a PCB, with a support structure extending over the hole to provide mechanical stability and expose connection points on both sides for easier inspection and improved cooling, allowing for the use of cooling devices on both the top and bottom sides of the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional BGA or PGA mounting techniques are used with connection points underneath the package, then the package can be mounted on the PCB, but the connections are prone to mechanical damage from thermal expansion and flexural stresses
Solution Approach 1:
The patent moves the connection points from a single plane (underneath the package) to multiple planes (both top and bottom sides of the package), allowing connections to be distributed across different dimensions and reducing stress concentration on any single connection point
Solution Approach 2:
The connection interface is segmented into multiple independent connection points distributed across both sides of the package, rather than having all connections concentrated underneath. This segmentation allows individual connections to bear less mechanical stress
2Ease of manufacture
If connection points are located underneath the package, then the package can be mounted using traditional techniques, but inspection of solder connection quality becomes difficult
Solution Approach 1:
By positioning connection points on both the top and bottom sides of the package rather than exclusively underneath, the inspection process can access connection quality from multiple vantage points, making solder joint examination significantly easier without requiring specialized under-package inspection equipment
3Adaptability or versatility
If traditional mounting techniques are used, then the package can be installed on the PCB, but cooling options become limited to only the top side
Solution Approach 1:
The patent enables thermal management from both the top and bottom sides of the package by positioning connection points and mounting structures on both faces, effectively adding a second dimension for heat dissipation pathways and doubling the available cooling surface area
Solution Approach 2:
Both the top and bottom sides of the package are designed to serve multiple functions: electrical connections, mechanical support, and thermal management. This multi-functionality allows the same structural elements to contribute to both signal transmission and heat dissipation
4Ease of operation
If all connection points are located underneath the package, then the package can be mounted using conventional methods, but the connections are difficult to access for inspection and maintenance
Solution Approach 1:
Distributing connection points across both top and bottom sides of the package creates accessibility from multiple directions, allowing operators to reach and work on connections without requiring complex disassembly or specialized access tools
Data Source
AI summary
Through-hole mounted semiconductor assemblies are described. A printed circuit board (“PCB”) has first and second PCB sides and has a through hole therein. The through hole defines a hole area. A semiconductor package may be disposed in the hole area such that the semiconductor package is at least partially exposed on one or more of the first and the second PCB sides. Package contacts on the semiconductor package may be electrically coupled to PCB contacts disposed on one or more of the PCB sides. In some embodiments, one or more support structures may be coupled to the PCB and may touch the semiconductor package. In some embodiments, cooling devices may be placed in thermal communication with the semiconductor package on both sides of the PCB.