Chip Package Through-Hole Layout With Sidewall Metal EMI Shielding
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Solution Overview
Problem
In chip packages, the presence of a metal can structure is necessary to prevent electromagnetic interference (EMI), but it hinders miniaturization due to its footprint and the gap between the metal can and the chip package, making it difficult to achieve smaller sizes.
Innovation Solution
A chip package design featuring a first substrate with an inclined sidewall, a second substrate extending beyond the inclined sidewall, a conductive layer between the substrates, and a metal layer on the sidewall and bottom surface, which can be grounded or act as a redistribution line, eliminating the need for an additional metal can structure by integrating shielding or antenna functions directly into the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal can structure is added to prevent EMI, then electromagnetic shielding is improved, but chip package size increases due to footprint and gap requirements
Solution Approach 1:
The patent merges the EMI shielding function with the antenna structure by integrating a metal layer directly onto the substrate. This metal layer serves dual purposes: it provides electromagnetic shielding for sensitive circuits while simultaneously functioning as an antenna element, eliminating the need for separate metal can structures and external antennas, thus reducing overall package size
Solution Approach 2:
The metal layer is designed to perform multiple functions within a single structure. It acts as both an EMI shield and an antenna, allowing the chip package to achieve electromagnetic interference protection and wireless communication capabilities without requiring additional components that would increase package volume
2Object-affected harmful factors
If a metal can structure is used for EMI protection, then shielding effectiveness is improved, but device complexity increases due to additional components and assembly steps
Solution Approach 1:
The patent combines multiple functions into a single integrated structure. The metal layer is formed as part of the substrate processing steps rather than as a separate component, merging the shielding function with the antenna structure and reducing the number of discrete parts and assembly operations required
Solution Approach 2:
The substrate and metal layer are designed to provide EMI shielding inherently through their own structure and material properties, without requiring additional protective enclosures. The metal layer itself serves as both the functional antenna element and the shielding barrier, making the system self-sufficient for EMI protection
Data Source
AI summary
A chip package includes a first substrate, a second substrate, a first conductive layer, and a metal layer. The first substrate has a bottom surface and an inclined sidewall adjoining the bottom surface, and an obtuse angle is between the bottom surface and the inclined sidewall. The second substrate is over the first substrate and has a portion that laterally extends beyond the inclined sidewall of the first substrate. The first conductive layer is between the first substrate and the second substrate. The metal layer is on said portion of the second substrate, on the bottom surface and the inclined sidewall of the first substrate, and electrically connected to an end of the first conductive layer.