Through-Hole Substrate Stress Layout to Limit Micro Crack Growth
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Solution Overview
Problem
The formation of micro cracks during the process of creating through holes in semiconductor substrates leads to substrate breakage and poor yield and reliability due to multiple thermal processes.
Innovation Solution
A package device with a substrate design that includes a through hole, where a first portion with compressive stress is closer to the surface than a second portion with tensile stress, reducing the likelihood of crack expansion during thermal processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through holes are formed in the substrate and multiple thermal processes are performed, then the substrate can support chips and enable circuit formation, but micro cracks are produced and substrate breakage occurs
Solution Approach 1:
The patent applies parameter changes by modifying the stress state in the substrate through a heat treatment process. The substrate is heated to a specific temperature range (400-800°C) to induce compressive stress in the region containing through holes, transforming the stress parameters to prevent crack propagation and improve reliability
Solution Approach 2:
The patent implements preliminary action by performing heat treatment to introduce compressive stress before the substrate undergoes subsequent thermal processes during chip packaging. This pre-established compressive stress field prevents micro crack formation and propagation in advance, protecting the substrate from breakage during later manufacturing steps
2Ease of manufacture
If multiple thermal processes are performed for circuit formation, then circuits can be created on the substrate, but existing micro cracks are aggravated and substrate breakage occurs
Solution Approach 1:
The patent changes the stress parameter distribution in the substrate by controlling the heat treatment temperature and duration. This creates a compressive stress field that counteracts the tensile stresses generated during subsequent thermal processes, maintaining substrate strength while enabling circuit formation
Solution Approach 2:
The patent provides beforehand cushioning by introducing compressive stress through heat treatment before the substrate undergoes multiple thermal processes. This compressive stress acts as a cushioning force that prevents micro cracks from aggravating and substrate from breaking during subsequent manufacturing operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the reliability and yield of the product by minimizing crack deterioration and improving stress balance within the substrate.
Implementation Method 1
the first portion of the substrate includes compressive stress, and the second portion of the substrate includes tensile stress
Implementation Method 2
the first portion of the substrate includes compressive stress, and the second portion of the substrate includes tensile stress
Data Source
AI summary
A package device is provided and includes a substrate and a conductive element. The substrate includes a through hole, a first portion, and a second portion, wherein the through hole penetrates the first portion and the second portion, and a first thickness of the first portion is less than a second thickness of the second portion. The conductive element is disposed in the through hole, wherein the first portion of the substrate includes compressive stress, and the second portion of the substrate includes tensile stress.