Through-Hole Substrate Connection for Compact Display Devices
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Solution Overview
Problem
Display devices with integrated touch sensors face challenges due to the need for additional space for flexible circuit boards, which increases dead space and makes them vulnerable to side impacts, especially when the lower substrate is longer than the upper substrate.
Innovation Solution
A display device design featuring a through hole in the upper substrate to electrically connect pads on both substrates, allowing for the mounting of display and touch sensor components on the upper substrate, reducing the need for extended lower substrate lengths and minimizing dead space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the lower substrate is extended to provide mounting space for display integrated circuit chip and flexible circuit board, then the mounting area is increased, but the dead space is enlarged and the substrate becomes vulnerable to side impact
Solution Approach 1:
The patent moves the mounting area from the lower substrate to the upper substrate by forming connection pads and through-holes. This dimensional transition allows components to be mounted on the upper substrate rather than extending the lower substrate, thereby reducing dead space and improving impact resistance while maintaining adequate mounting area.
2Adaptability or versatility
If a flexible circuit board is attached to the display panel for touch sensor function, then the touch sensing capability is enabled, but the dead space is further enlarged
Solution Approach 1:
The patent integrates the touch sensor function directly into the display panel structure by forming touch electrodes on the upper substrate and connecting them through the same through-holes used for display circuit connections. This merging eliminates the need for a separate flexible circuit board, enabling touch sensing while minimizing dead space.
3Ease of manufacture
If the lower substrate is made longer to accommodate additional components, then the component mounting capacity is increased, but the structural integrity is reduced
Solution Approach 1:
The patent relocates component mounting from the lower substrate to the upper substrate through the formation of connection pads and vertical connections via through-holes. This vertical dimensionality change allows adequate component mounting capacity without extending the lower substrate length, thereby preserving structural integrity and resistance to side impacts.
Data Source
AI summary
A display device includes: a display panel having: a lower substrate; an upper substrate facing the lower substrate and having at least one through hole formed therein; a display active layer disposed between the lower substrate and the upper substrate; at least one lower pad disposed on the lower substrate; a touch sensing layer disposed on the upper substrate; and at least one connection pad disposed on the upper substrate. The connection pads are electrically connected to the lower pads through connectors disposed in the though holes of the upper substrate.