Through-Hole Terminal Display Panel Bezel Reduction
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Solution Overview
Problem
Tiled display apparatuses suffer from deteriorated display quality due to the bezel width defined in the boundary area of display panel modules, which creates black or gray frames and reduces overall screen appearance quality.
Innovation Solution
The implementation of a display panel design with through-hole terminals and external signal lines in the peripheral areas, allowing for staggered or non-staggered substrate structures and the use of flexible circuit films and printed circuit boards to connect the driving circuit units, reducing the bezel width and shielding area between display panels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional display panel module structure with OLB bonding is used, then the display panel can be connected to external devices and driving circuits, but the bezel width in the boundary area increases creating black or gray frames that deteriorate display quality
Solution Approach 1:
The patent transitions the connection structure from a planar configuration to a three-dimensional configuration by forming through-holes through the substrate thickness direction. This allows signal lines to pass through the substrate vertically rather than horizontally across the periphery, enabling the display area to extend to the edges without requiring peripheral bonding areas, thus eliminating the bezel width issue while maintaining connection reliability
Solution Approach 2:
The patent embeds the through-hole terminals within the substrate structure itself, nesting the connection function inside the display panel module. The conductive material filling the through-holes is integrated within the substrate, allowing external signal lines to connect through the substrate thickness rather than requiring external bonding areas, thereby reducing the bezel width while maintaining reliable connections
2Area of stationary object
If the peripheral area is reduced to minimize boundary frames, then the display quality improves, but the space for arranging signal lines and connecting structures becomes insufficient
Solution Approach 1:
The patent resolves the space constraint by utilizing the thickness dimension of the substrate. Instead of arranging signal lines horizontally in the peripheral area, the through-holes provide vertical pathways through the substrate, effectively moving the connection structures into the third dimension. This allows the display area to maximize the planar surface while signal lines are routed through the substrate thickness, eliminating the trade-off between display area and signal line arrangement space
Solution Approach 2:
The patent segments the signal transmission path into multiple layers: external signal lines on the surface, through-hole terminals within the substrate, and internal signal lines connecting to pixel electrodes. This segmentation allows each component to be optimized independently, with the through-holes providing dedicated vertical pathways that simplify the overall signal line arrangement while enabling maximum display area
Data Source
AI summary
A display panel includes a display area, in which a plurality of pixels is arranged and a plurality of peripheral areas surrounding the display area. The display panel includes a first substrate, a second substrate disposed opposite to the first substrate, a first external signal line disposed on the first substrate in a first peripheral area of plurality of peripheral areas and connected to an external device, and a first through-hole terminal including a conductive material filled in a hole defined through the first substrate in an area in which the first external signal line is disposed.