Through-Hole Semiconductor Wind Sensor for Stable Airflow Measurement
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Solution Overview
Problem
Hot wire-type wind speed sensors are significantly affected by ambient temperature and humidity, leading to errors in measurement and reduced productivity, particularly in extreme weather conditions.
Innovation Solution
A semiconductor-type wind speed sensor with a substrate having a through hole and electrodes connected by a metal wire, where the metal wire is positioned above the through hole, allowing air flow to pass through and enabling temperature control and resistance value changes for accurate wind speed calculation, with a simple manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If hot wire-type sensors are used for wind speed measurement, then electrical conversion and signal processing are easy to perform, but the sensors are greatly affected by ambient temperature and humidity causing measurement errors
Solution Approach 1:
The patent replaces the traditional hot wire-type sensor with a semiconductor-type sensor that uses a metal wire suspended in a through-hole structure. This mechanical/structural approach substitutes the electrical resistance-based measurement method, reducing sensitivity to ambient temperature and humidity while maintaining ease of signal processing through the same electrical connection principles.
2Reliability
If hot wire-type temperature and wind speed sensors are used, then measurement function is provided, but productivity decreases due to high incidence of defective products in extreme weather
Solution Approach 1:
The patent changes the fundamental operating parameters of the sensor by transitioning from hot wire-type (heated wire measuring resistance change) to semiconductor-type (metal wire in through-hole measuring physical displacement or resistance change with reduced environmental sensitivity). This parameter change reduces the incidence of defective products in extreme weather conditions, thereby improving manufacturing productivity while maintaining measurement functionality.
3Reliability
If material and structural supplementation is added to hot wire-type sensors to improve stability, then measurement reliability improves, but device complexity increases
Solution Approach 1:
The patent extracts the metal wire and places it within a through-hole structure, separating the sensing element from the environmental influences. This extraction approach provides operational stability without requiring additional complex supplementary materials or structures, as the through-hole configuration itself protects the metal wire from ambient temperature and humidity effects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The semiconductor-type wind speed sensor provides reliable and accurate wind speed measurements with reduced sensitivity to ambient temperature and humidity, enhancing productivity and reducing defective products.
Implementation Method 1
measures the flow velocity based on a change in electrical resistance of the metal wire due to a change in a temperature of the metal wire by the cooling effect caused by the flow velocity
Implementation Method 2
a value of the electrical resistance may increase. Therefore, it is possible to measure the flow velocity by monitoring a change in the value of the electrical resistance
Data Source
AI summary
A semiconductor-type wind speed sensor is provided. The semiconductor-type wind speed sensor includes a substrate including a through hole, a pair of electrodes formed on the substrate, and a metal wire configured to electrically connect the pair of electrodes.