Through-Hole Wire-Bonding Structure for Stable Electrode Connection
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Solution Overview
Problem
The existing methods for bonding connecting wires and electrodes at through holes in devices face high failure rates due to the formation of a black film material on the electrode surface, which hinders a stable connection, and the difficulty in accurately positioning the electrode at the edge of the through hole.
Innovation Solution
The implementation of wire-bonding bump electrodes on the packaging substrate, which are integrated or arranged on different electrode layers, enhances the success rate and flexibility of wire bonding by ensuring a stable connection between the connecting wire and the electrode, even in the central area of the through hole.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is conducted at the through hole electrode, then electrical connection is achieved, but the bonding fails due to black film formation on the electrode surface
Solution Approach 1:
The patent introduces a wire-bonding electrode as an intermediary element between the through-hole electrode and the connecting wire. This wire-bonding electrode is specifically designed with a flat bonding surface that does not form black films, serving as a mediator to enable successful wire bonding while the through-hole electrode maintains its original function. The intermediary structure isolates the harmful black film formation from the bonding interface.
2Manufacturing precision
If wire bonding is attempted at the edge of the through hole, then connection may be achieved, but positioning accuracy is difficult to maintain
Solution Approach 1:
The patent segments the electrode structure into distinct functional parts: the through-hole electrode for electrical connection and the separate wire-bonding electrode for precise wire attachment. This segmentation allows each component to be optimized independently - the wire-bonding electrode can be positioned with high precision on the packaging substrate without being constrained by the through-hole location, thereby improving both positioning accuracy and operational ease.
Solution Approach 2:
The patent transitions from a two-dimensional bonding surface at the through-hole edge to a three-dimensional structure with a wire-bonding electrode that extends outward. This dimensional change provides an accessible bonding surface that is easier to position and bond to, while maintaining electrical connection through the underlying through-hole electrode structure.
3Ease of manufacture
If traditional wire bonding method is used, then simple process is maintained, but bonding reliability is low
Solution Approach 1:
The wire-bonding electrode is formed in advance during the substrate fabrication process, before the wire bonding operation. This preliminary action prepares an optimal bonding surface with appropriate geometry and material properties, ensuring high bonding reliability when the wire bonding process is subsequently performed. The bonding surface is pre-configured to prevent black film formation and facilitate reliable attachment.
Data Source
AI summary
Functional component, forming method thereof and electronic device are provided. The functional component includes a packaging substrate and a connecting wire. The packaging substrate includes a through-hole wire-bonding area including a first insulating layer and a wire-bonding electrode sequentially formed on the substrate. The first insulating layer includes a first through hole, and the wire-bonding electrode covers the first through hole. In an area corresponding to the first through hole, the packaging substrate has wire-bonding bump electrodes on a side of the wire-bonding electrode away from the first insulating layer. The connecting wire includes a wire-bonding connection portion and a wire-bonding extension portion connected to the wire-bonding connection portion. The wire-bonding connection portion is fixedly connected to the wire-bonding electrode. The wire-bonding connection portion extends to cover at least a partial area of a side of at least one of the wire-bonding bump electrodes.