Through-Type MLCC Electrode Layout to Prevent Short Circuits
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Solution Overview
Problem
In through-type multilayer ceramic capacitors, miniaturization leads to challenges in controlling the spacing between outer electrodes, increasing the risk of short circuit defects and electrochemical migration.
Innovation Solution
The capacitors are designed with a multilayer body having dielectric and inner electrode layers, where outer electrodes are strategically positioned with plating layers and charging electrodes of shorter lengths to maintain adequate spacing and prevent electrical shorts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the through-type multilayer ceramic capacitor is reduced, then miniaturization is achieved, but the distance between terminal electrodes is shortened and coating control becomes difficult
Solution Approach 1:
The outer electrode is divided into two distinct parts: a plating layer and a charging electrode. The plating layer provides the necessary coating for electrical connection and protection, while the charging electrode is designed with a shorter length that does not wrap around the side surfaces. This segmentation allows the plating layer to maintain adequate coverage for manufacturing reliability while the charging electrode avoids excessive extension that would cause short circuit risks in miniaturized designs.
Solution Approach 2:
Different portions of the outer electrode structure are given different functional qualities. The plating layer is designed with sufficient length and coverage to ensure reliable electrical connection and coating adhesion, while the charging electrode is intentionally made shorter to prevent it from wrapping around side surfaces and approaching other electrodes. This local differentiation of electrode qualities allows the capacitor to maintain manufacturing precision while achieving miniaturization.
2Volume of moving object
If the size of the through-type multilayer ceramic capacitor is reduced, then miniaturization is achieved, but the risk of short circuit defects and electrochemical migration increases
Solution Approach 1:
By separating the outer electrode into a plating layer and a charging electrode with different lengths, the design ensures that only the necessary plating layer extends to provide reliable electrical connection, while the charging electrode is limited in length to prevent it from wrapping around side surfaces and creating short circuit pathways. This segmentation directly addresses the reliability issue in miniaturized capacitors.
Solution Approach 2:
The charging electrode is designed with a predetermined shorter length that explicitly prevents it from reaching or approaching other electrodes on side surfaces. This preliminary design constraint acts as a preventive measure against electrochemical migration and short circuit defects before they can occur, especially important in miniaturized where spacing is reduced.
3Volume of moving object
If the inner electrode layers are narrowed to accommodate miniaturization, then the capacitor size is reduced, but the manufacturing process becomes more difficult
Solution Approach 1:
The outer electrode is segmented into a plating layer and a charging electrode, where the plating layer maintains sufficient dimensions for reliable manufacturing and electrical connection. This allows the inner electrode layers to maintain their standard width without requiring narrowing, while the charging electrode's shorter length compensates for the overall size reduction. This segmentation approach enables miniaturization without compromising inner electrode manufacturability.
Data Source
AI summary
A through-type multilayer ceramic capacitor includes a multilayer body including laminated dielectric layers, inner electrode layers laminated on the dielectric layers, first and second inner electrode layer, a first outer electrode on a first end surface of the multilayer body and connected to the first inner electrode layer, a second outer electrode on a second end surface of the multilayer body and connected to the first inner electrode layer, a third outer electrode on a first side surface of the multilayer body and connected to the second inner electrode layer, and a fourth outer electrode on a second side surface of the multilayer body and connected to the second inner electrode layer. The first outer electrode includes a first plating layer and a first charging electrode, and the second outer electrode includes a second plating layer and a second charging electrode.