Through-Mold Cooling Channel for Stacked Die Heat Dissipation
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Solution Overview
Problem
Vertically stacked semiconductor dies face challenges in heat dissipation, leading to increased operating temperatures due to the difficulty in effectively transferring heat away from the densely packed packages.
Innovation Solution
Incorporation of a through-mold cooling channel within the package casing, utilizing a thermal conductor and dielectric fluid to facilitate heat transfer from the semiconductor dies to the ambient environment through an immersion cooling system, with features like vias, channels, and condensers to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor dies are vertically stacked to increase processing power without increasing package footprint, then the functional capacity of the package is improved, but heat dissipation becomes difficult and operating temperatures increase
Solution Approach 1:
The package is segmented into multiple functional layers: semiconductor dies for processing, thermal interface material for heat transfer, vapor chamber for heat dissipation, and condensers for heat removal. This segmentation allows each component to specialize in a specific thermal management function, effectively resolving the heat dissipation challenge of vertically stacked dies
Solution Approach 2:
A thermal interface material acts as an intermediary between the semiconductor dies and the vapor chamber, facilitating efficient heat transfer from the dies to the cooling structure. This intermediary component bridges the thermal gap and enables effective heat removal from the densely stacked dies
2Area of stationary object
If vertically stacked packages are used to increase functional capacity, then the package footprint is reduced, but heat dissipation pathways are limited
Solution Approach 1:
The invention transitions from two-dimensional heat dissipation (lateral heat paths on die surface) to three-dimensional heat dissipation by introducing vertical heat pathways through the vapor chamber and condensers. This dimensional change enables heat to be removed from the bottom of the package, bypassing the footprint constraint and providing additional thermal management capacity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the operating temperatures of semiconductor dies by efficiently transferring heat away from the package, maintaining electrical integrity while preventing thermal interference.
Implementation Method 1
The via includes a thermal conductor that thermally couples the peripheral region of the first die with the cover
Implementation Method 2
utilizing a thermal conductor and dielectric fluid to facilitate heat transfer from the semiconductor dies to the ambient environment through an immersion cooling system
Implementation Method 3
with features like vias, channels, and condensers to enhance heat dissipation
Data Source
Figure 1A~1B
Figure 2~3
Figure 4~5
AI summary
Semiconductor device assemblies having stacked semiconductor dies and thermal transfer devices that include vapor chambers are disclosed herein. In one embodiment, a semiconductor device assembly includes a first semiconductor die having a base region, at least one second semiconductor die at the base region, and a thermal transfer device attached to the first and second dies. The thermal transfer device includes an encapsulant at least partially surrounding the second die and a via formed in the encapsulant. The encapsulant at least partially defines a cooling channel that is adjacent to a peripheral region of the first die. The via includes a working fluid and/or a solid thermal conductor that at least partially fills the channel.