Through-Mold Connection Structure for Stable Fine-Pitch Packaging
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Solution Overview
Problem
Conventional electronic packages face issues with deformation and material removal of solder balls during manufacturing processes, leading to increased pitch spacing and vulnerability to cracking under impact forces, which affect mechanical stability and reliability.
Innovation Solution
The use of non-reflowable electrically conductive materials, such as copper, nickel, and gold, to form through-mold connections that are encapsulated and exposed without moats or channels, allowing closer spacing and improved mechanical performance, along with a simplified manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder balls are used for electrical connections, then electrical conductivity is achieved, but deformation and material removal occur during manufacturing leading to increased pitch spacing and reduced mechanical stability
Solution Approach 1:
The patent changes the material parameter from solder balls (reflowable) to non-reflowable electrically conductive material such as copper, nickel, gold, or silver. This material substitution eliminates deformation and material removal during manufacturing processes, maintaining consistent pitch spacing and improving mechanical stability under impact forces.
Solution Approach 2:
The patent replaces the traditional solder ball approach with a more durable non-reflowable conductive material that does not deform or require reflow processing. This substitution eliminates the need for moat or channel structures, simplifying the package design and improving mechanical integrity.
2Ease of manufacture
If moats or channels are created around solder balls, then soldering is facilitated, but manufacturing complexity and material removal increase
Solution Approach 1:
The patent extracts and eliminates the moat or channel structure from the package design. By using non-reflowable electrically conductive material that maintains its shape and does not require reflow soldering, the complex mold structures needed to create moats or channels become unnecessary, simplifying the overall device complexity.
3Productivity
If grinding and laser ablation are performed on mold structure, then solder balls are exposed, but manufacturing time and material removal increase
Solution Approach 1:
The patent applies preliminary action by designing the non-reflowable electrically conductive material to be exposed through the mold structure in a predetermined manner during the molding process itself. This eliminates the need for subsequent grinding or laser ablation steps, reducing manufacturing cycle time and increasing productivity.
4Strength
If non-reflowable electrically conductive material is used, then mechanical stability under impact is improved, but electrical conductivity requirements must be maintained
Solution Approach 1:
The patent changes the material parameters by selecting non-reflowable electrically conductive materials such as copper, nickel, gold, or silver that possess both high electrical conductivity and high mechanical strength. These materials maintain their structural integrity under impact forces while providing reliable electrical connections, simultaneously satisfying both strength and conductivity requirements.
Data Source
AI summary
An electronic package is provided. The electronic package comprises a substrate having a first side and a second side, the substrate configured to receive one or more electronic components; a first electronic component mounted to the first side of the substrate; a first mold structure extending over at least part of the first side of the substrate; a group of through-mold connections provided on the first side of the substrate, the through-mold connections substantially formed of non-reflowable electrically conductive material; the first mold structure substantially encapsulating the group of through-mold connections; the group of through-mold connections exposed through the first mold structure. An electronic device comprising such an electronic package is also provided. A method of manufacturing such an electronic package is also provided.