Through-Mold Strain Gauge Assembly for Die Strength Prediction
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Solution Overview
Problem
Semiconductor device manufacturers face challenges in measuring and predicting the strength of semiconductor devices and packaging to ensure survivability under potentially destructive forces, such as dropping or crushing, which can damage internal components.
Innovation Solution
Incorporating in situ strain gauges within semiconductor device assemblies at various depths, connected via through mold vias (TMVs), allowing for simultaneous strain measurements at multiple positions to inform design and testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional external measurement methods are used, then device complexity is reduced, but measurement precision of internal strain is insufficient
Solution Approach 1:
The strain gauge is nested within the molding material, which encapsulates the semiconductor die. This nested configuration allows the strain gauge to be embedded at various depths within the molding to measure strain at different locations, achieving precise internal strain measurement while maintaining a compact integrated structure without adding external measurement apparatus.
Solution Approach 2:
Through mold vias (TMVs) are introduced as intermediary conductive structures that extend from the outer surface of the molding to the strain gauge embedded within. These TMVs provide electrical connection between the internal strain gauge and external measurement equipment, enabling strain measurement at depths within the molding while maintaining device integration.
2Reliability
If single-point strain measurement is used, then device complexity is minimized, but reliability of strength prediction is reduced
Solution Approach 1:
The measurement system is segmented into multiple strain gauges positioned at different depths and locations within the molding material. This segmentation allows simultaneous measurement of strain at multiple critical positions, providing comprehensive strain distribution data that improves the reliability of strength predictions for the semiconductor device assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate measurement and prediction of strain distribution within semiconductor devices, enhancing their resistance to hazardous scenarios and ensuring survivability in electronic products.
Implementation Method 1
a strain gauge disposed in the molding at the depth of the TMV
Data Source
AI summary
Systems and methods for measuring and predicting the strength of semiconductor devices and packaging are disclosed. In some embodiments, a semiconductor device assembly comprises a package substrate, a semiconductor die electrically coupled to the package substrate, and a molding covering at least a portion of the semiconductor die, where the molding includes a through-mold via (TMV) extending from an upper surface into the mold material to a depth. The semiconductor device assembly can include a strain gauge disposed in the molding at the depth of the TMV and be electrically coupled to the TMV. For example, the TMV can extend to the surface of the semiconductor die, to the package substrate, or other critical areas of the semiconductor device assembly, enabling strain to be measured at these depths. The semiconductor device assembly can be used in testing to predict the strength of the die and packaging in real-world scenarios, such as being dropped, bent, or crushed.