Through-Mold Via Packaging for High-I/O Die Stacking
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Solution Overview
Problem
Existing semiconductor devices face challenges in integrating multiple semiconductor dies due to limited space for input/output terminals, especially when miniaturized, leading to difficulties in forming sufficient electrical connections and stacking additional devices.
Innovation Solution
The introduction of through-mold vias (TMVs) in the package body of semiconductor devices, which provide electrical signal paths from the exterior surface to the conductive pattern of the substrate, allowing for increased input/output terminals and enabling stacking of additional semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the semiconductor device is reduced, then the space needed to accommodate the device is minimized, but the available space for input/output terminals is restricted
Solution Approach 1:
The patent transitions from two-dimensional terminal arrangement (solely on lower external surface) to three-dimensional terminal distribution (through-mold vias extending through the package body to expose terminals on both upper and lower surfaces). This dimensional change allows increased I/O capacity without increasing device footprint, directly resolving the contradiction between miniaturization and terminal availability.
2Adaptability or versatility
If plural semiconductor dies are stacked in a single semiconductor device, then the number of functions is increased, but the available space for input/output terminals is further restricted
Solution Approach 1:
By implementing through-mold vias that penetrate the package body, the patent creates vertical electrical pathways that enable multiple semiconductor dies to be stacked while maintaining adequate I/O terminal availability on both upper and lower surfaces. This resolves the contradiction by utilizing the vertical dimension for both die stacking and terminal access.
Solution Approach 2:
The patent employs a nested structure where multiple semiconductor dies are stacked within a single package body, with through-mold vias providing electrical connections through the nested arrangement. This allows increased functionality through die stacking while maintaining terminal availability through the encapsulant material.
3Volume of moving object
If the size of the semiconductor device is reduced, then the space needed is minimized, but it is difficult to form sufficient input/output terminals
Solution Approach 1:
The through-mold via technology provides a systematic approach to forming electrical pathways in the vertical dimension, transforming the complex task of creating sufficient I/O terminals on limited surface area into a more manageable process of drilling and filling vias through the package body. This resolves the contradiction between miniaturization and terminal formation difficulty.
Data Source
AI summary
A semiconductor device includes a substrate with a conductive pattern. A semiconductor die is electrically connected to the substrate and both the semiconductor die and the substrate are at least partially covered by a package body. In some examples, through-mold vias are formed in the package body to provide electrical signal paths from an exterior surface thereof to the conductive pattern of the substrate. In some examples, through-mold vias are included in the package body to provide electrical signal paths between the semiconductor die and an exterior surface of the package body. In some examples, an interposer is electrically connected to the through-mold vias and may be covered by the package body and/or disposed in spaced relation thereto. In some examples, the interposer may not be electrically connected to the through-mold vias but may have one or more semiconductor dies of the semiconductor device electrically connected thereto.