Split Metallic Seal Structures for Protected Die-to-Die Routing
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Solution Overview
Problem
The integration of higher circuit densities and smaller form factors in semiconductor dies poses challenges in protecting against defects such as cracking, delamination, moisture ingress, and noise, particularly during the singulation process, while maintaining efficient die-to-die connectivity.
Innovation Solution
The implementation of chip sealing structures that accommodate die-to-die routing through split metallic seal structures, sealed box structures, and electromagnetic field communication, which provide protection against microcracking, delamination, and moisture ingress, while enabling inter-die and intra-die connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If seal rings are formed to completely surround circuit areas to protect against cracking and delamination, then protection against defects is improved, but die-to-die connectivity is worsened due to blocked routing paths
Solution Approach 1:
The continuous seal ring is divided into multiple segments that are spaced apart from each other. This segmentation allows routing lines to pass through the gaps between segments while the segments themselves maintain the protective sealing function against cracking and delamination during dicing.
Solution Approach 2:
Different regions of the seal structure have different properties: the seal segments provide protection in critical areas, while the gaps between segments provide routing access. This local differentiation allows simultaneous achievement of protection and connectivity.
2Ease of operation
If openings are provided within seal rings to allow electrical interconnect lines to connect adjacent dies, then die-to-die connectivity is improved, but protection against moisture ingress and ion diffusion is worsened
Solution Approach 1:
The seal segments act as intermediary structures that provide both protection and controlled access. They are positioned to block harmful factors like moisture and ions while allowing routing lines to pass through the spaces between them, serving dual functions simultaneously.
Solution Approach 2:
The routing lines pass through the seal structure in a different spatial dimension (through the gaps between segments rather than breaking the seal continuity). This dimensional approach allows connectivity without compromising the sealing barrier.
3Reliability
If continuous filled trenches and vias are used to form seal rings, then protection against defects is improved, but device complexity is worsened due to additional manufacturing steps
Solution Approach 1:
The seal ring segments are formed as part of the existing BEOL metallization structure during standard manufacturing processes, rather than being added as a separate post-processing step. This preliminary integration reduces manufacturing complexity while maintaining protective functionality.
Solution Approach 2:
The same metallization layers and processes used for creating interconnect structures are also used to form the seal ring segments. This multi-functionality of existing manufacturing steps reduces overall process complexity while achieving both connectivity and protection.
Data Source
AI summary
Chip sealing designs to accommodate die-to-die communication are described. In an embodiment, a chip structure includes a split metallic seal structure including a lower metallic seal and an upper metallic seal with overlapping metallization layers, and a through seal interconnect navigating through the split metallic seal structure.