Through-Stiffener Substrate Assembly for Shorter Memory Signal Paths
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Solution Overview
Problem
Legacy packages in mobile electronic devices face constraints in electrical signaling bandwidth and power delivery due to lengthy signal transmission paths and impedance discontinuities, leading to crosstalk coupling noises and signal degradation, which hinder memory data rate scaling and require complex circuitry for compensation.
Innovation Solution
Implementing a stiffener between substrates to secure a second substrate to a first substrate, using compressible interconnects and fasteners to create a direct electrical coupling, reducing signal latency and enhancing power delivery by bringing processor dies and memory devices closer in proximity, and integrating power delivery components directly on detachable substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If legacy compression connectors are used to connect memory substrate with motherboard, then electrical connection is established, but signal transmission path becomes lengthy causing impedance discontinuities and crosstalk
Solution Approach 1:
The patent transitions from lateral PCB routing to vertical through-stiffener routing. Electrical interconnects pass through the stiffener thickness (z-dimension) to directly connect processor dies on one substrate to memory devices on another substrate, eliminating lengthy lateral paths along the PCB surface and reducing impedance discontinuities.
Solution Approach 2:
The patent extracts the electrical connection function from the traditional PCB compression connector and relocates it to the stiffener structure. The stiffener becomes the primary interconnection medium with integrated electrical interconnects, separating the mechanical support function from the electrical interconnection function and enabling shorter signal paths.
2Reliability
If processor dies and memory devices are placed on separate substrates connected via PCB, then device functionality is achieved, but signal latency increases due to lengthy transmission paths
Solution Approach 1:
The patent implements a nested structure where the stiffener is attached to the processor substrate, and the memory substrate is subsequently attached to the stiffener. This creates a compact stacked arrangement with the stiffener serving as both mechanical support and electrical interconnection medium, minimizing the distance between processor dies and memory devices.
Solution Approach 2:
The patent utilizes the vertical dimension (through the stiffener thickness) for electrical interconnection, bringing processor dies and memory devices into close proximity in the z-direction. This vertical stacking approach replaces traditional lateral routing, significantly reducing the physical distance signals must travel between processor and memory components.
3Power
If traditional PCB routing is used for power delivery, then power can be delivered to components, but power delivery performance is limited and power consumption increases
Solution Approach 1:
The patent integrates power delivery components (power management ICs, capacitors, inductors) directly onto the memory substrate within the stacked package. This nested arrangement places power delivery components in close proximity to both the processor dies and memory devices, reducing power transmission distance and minimizing energy loss through resistive heating and electromagnetic radiation.
Solution Approach 2:
The stiffener acts as an intermediary structure that facilitates direct power delivery from the memory substrate to the processor substrate. Electrical interconnects through the stiffener provide low-impedance power paths, replacing high-impedance PCB traces and reducing power loss during transmission between components.
4Volume of moving object
If memory devices are connected via compression connector on PCB, then electrical connection is established, but package size cannot be reduced due to required routing areas
Solution Approach 1:
The patent moves electrical interconnections from the two-dimensional PCB surface to the three-dimensional through-stiffener structure. By routing electrical interconnects vertically through the stiffener thickness, the design eliminates the need for extensive lateral PCB routing areas, enabling significant package size reduction while maintaining all necessary electrical connections.
Solution Approach 2:
The patent merges the mechanical support function and electrical interconnection function into the single stiffener structure. This consolidation eliminates the need for separate PCB routing layers and compression connectors, reducing the overall package footprint by eliminating redundant structural and electrical pathways.
Data Source
AI summary
Embodiments herein relate to systems, apparatuses, techniques, or processes directed to semiconductor packages that use a stiffener on a first substrate to secure a second substrate to the first substrate. The stiffener may include one or more compressible interconnects to electrically couple the first substrate and the second substrate. A fastener may extend through the second substrate and through the stiffener to secure the first substrate and the second substrate with each other. Other embodiments may be described and/or claimed.