Through-Substrate Assembly for Borderless Display Layout
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Solution Overview
Problem
Conventional display devices have limited effective display space due to the large non-display area where the processing unit and display unit are formed on the same substrate, resulting in inefficient use of space.
Innovation Solution
A substrate assembly with a first and second surface, featuring a first conductive portion on the first surface, a second conductive portion on the second surface, and a connective portion that penetrates through the substrate, allowing electrical connection between the processing unit and the display element, thereby optimizing space usage by eliminating the need for additional area for signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the processing unit and display unit are formed on the same surface of the substrate, then the electrical connection is simple, but the effective display space is limited due to large non-display area
Solution Approach 1:
The patent applies dimensionality change by moving the processing unit from the same surface (2D plane) to the opposite surface of the substrate, utilizing the third dimension (thickness direction) to resolve the space conflict. This allows the display unit to occupy the entire front surface while the processing unit is positioned on the back surface, connected through conductive portions penetrating the substrate.
Solution Approach 2:
The conductive portions are embedded within the substrate thickness, nesting the electrical connection path inside the substrate structure. This allows electrical connections to pass through the substrate without occupying additional lateral space, enabling the processing unit and display unit to be positioned on opposite surfaces while maintaining electrical connectivity.
2Area of stationary object
If the processing unit is placed on the same surface as the display unit, then the manufacturing process is simple, but the border area is large
Solution Approach 1:
The invention relocates the processing unit to the opposite surface of the substrate, utilizing the thickness dimension to eliminate the need for large border areas on the display surface. This dimensional relocation allows the display unit to extend to the edges of the substrate without requiring additional space for processing components on the same surface.
Solution Approach 2:
The conductive portions serving as intermediaries penetrate the substrate to establish electrical connections between the display unit on the front surface and the processing unit on the back surface. This intermediary connection method enables spatial separation of functional units while maintaining electrical continuity, simplifying the overall manufacturing process despite the three-dimensional arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the effective display space by allowing the processing unit to be placed on one surface and the display element on the other, reducing the border area and enabling a more compact, borderless display device design.
Implementation Method 1
The first conductive portion is electrically connected to the second conductive portion through the connective portion
Data Source
AI summary
A substrate assembly includes a substrate having a first surface and a second surface opposite to the first surface. The substrate assembly includes a first conductive portion disposed on the first surface, and a second conductive portion disposed on the second surface. The substrate assembly includes a connective portion that is at least partially disposed in the substrate and penetrates from the first surface to the second surface. The first conductive portion is electrically connected to the second conductive portion through the connective portion. The substrate assembly includes a processing unit disposed on the first surface, and an electronic element disposed on the second surface. The first conductive portion, the second conductive portion and the connective portion are overlapped with either of the processing unit or the electronic element, and the other of the processing unit or the electronic element is electrically connected to the first conductive portion.