Through-Substrate Conductive Portion for LCD Connection
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Solution Overview
Problem
Conventional liquid crystal display device manufacturing techniques are complex and do not provide high yield or operational reliability, leading to a competitive disadvantage.
Innovation Solution
A display device design featuring a conductive portion passing through the substrate to electrically couple an integrated driving circuit and a backlight source, simplifying the connection of internal components and reducing substrate damage during manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional manufacturing techniques are used for liquid crystal display devices, then the manufacturing process is established and reproducible, but the manufacturing technique is complicated and cannot provide high yield and high operational reliability
Solution Approach 1:
The patent divides the manufacturing process into distinct segments: first forming the conductive portion through the substrate, then bonding the driving circuit board, and finally bonding the backlight source. This segmentation allows each step to be optimized independently, simplifying the overall manufacturing technique while improving yield and reliability through standardized, repeatable processes.
Solution Approach 2:
The conductive portion is formed through the substrate before bonding the driving circuit board and backlight source. This preliminary action establishes the electrical connection pathways in advance, allowing subsequent components to be bonded without complex alignment procedures, thereby reducing manufacturing complexity and improving yield.
2Ease of manufacture
If conventional connection methods are used for internal components, then the components can be connected, but the connection process is complex and increases substrate damage risk
Solution Approach 1:
The conductive portion serves as an intermediary element that passes through the substrate and provides electrical connection between the driving circuit board and backlight source. This intermediary approach eliminates the need for complex through-substrate wiring, simplifying the connection process and reducing mechanical stress that could damage the substrate.
Solution Approach 2:
Instead of creating complex two-dimensional wiring patterns on the substrate surface, the patent uses a three-dimensional approach by forming a conductive portion that passes through the substrate thickness. This dimensional change simplifies the connection geometry and reduces manufacturing complexity while minimizing substrate damage risk.
Data Source
AI summary
A display includes a first substrate, a second substrate, a liquid crystal layer, a backlight source, a driving integrated circuit and a conductive portion. The liquid crystal layer is disposed between the first substrate and the second substrate. The backlight source is disposed at a first side of the second substrate. The driving integrated circuit is disposed at a second side, opposite to the first side, of the second substrate. The conductive portion is electrically coupled to the driving integrated circuit and passes through the second substrate to be electrically coupled to the backlight source. Furthermore, a display manufacturing method thereof is also disclosed here.