Through-Substrate Display Layout for Borderless Driver Integration
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Solution Overview
Problem
Existing display devices are not cost-effective due to inefficiencies in manufacturing processes, particularly in the integration of light-emitting units and driver units, which often require sacrificing peripheral area for the driver unit, limiting their design and performance.
Innovation Solution
A borderless display device design where light-emitting units are disposed on one surface of the substrate and the driver unit is on the opposite surface, with conductive structures connecting them, allowing for a more efficient use of space and improved visual effect when multiple devices are connected.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the driver unit is disposed on the same surface as the light-emitting units, then the manufacturing process is simplified, but the peripheral area is sacrificed and the borderless appearance is compromised
Solution Approach 1:
The driver unit is moved from the same surface (2D plane) to the opposite surface of the substrate, utilizing the third dimension (depth/height) to resolve the spatial conflict. This allows the light-emitting units to occupy the entire front surface for a borderless appearance while the driver unit is positioned on the rear surface, eliminating the need to sacrifice peripheral area.
2Area of stationary object
If the driver unit is disposed on the opposite surface of the substrate, then the peripheral area is preserved and borderless appearance is achieved, but the device complexity increases
Solution Approach 1:
Conductive structures serving as intermediaries are introduced to establish electrical connections between the light-emitting units on the front surface and the driver unit on the rear surface. These conductive structures act as mediators that enable communication and power transmission across the substrate thickness, resolving the complexity issue by providing a straightforward connection path despite the spatial separation.
3Ease of manufacture
If conventional integration methods are used, then manufacturing is easier, but cost-effectiveness is reduced due to material and space inefficiency
Solution Approach 1:
By transitioning from a planar integration approach to a three-dimensional arrangement with the driver unit on the opposite surface, the patent maximizes the utilization of substrate volume. This dimensional change eliminates wasted peripheral space, allows for more efficient material distribution, and improves overall manufacturing cost-effectiveness while maintaining manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables a cost-effective and visually superior display device by eliminating the need to sacrifice peripheral area for the driver unit, enhancing the display's borderless appearance and performance, especially when forming large-sized displays.
Implementation Method 1
a plurality of conductive structures penetrating through the substrate from the first surface to the second surface, wherein the plurality of conductive structures are corresponding to the plurality of diodes and electrically connected to the plurality of diodes
Implementation Method 2
The recombination radiation of electron and hole in the light-emitting diode may produce electromagnetic radiation (such as light) through the current at the p-n junction
Data Source
AI summary
A device includes a substrate having a first surface and a second surface opposite to the first surface; a thin-film transistor array disposed on the first surface, including a plurality of transistors; a plurality of diodes disposed on the thin-film transistor array; a plurality of conductive structures penetrating through the substrate from the first surface to the second surface, wherein the plurality of conductive structures are corresponding to the plurality of diodes and electrically connected to the plurality of diodes; a driver unit disposed on the second surface of the substrate; a patterned conductive layer disposed between the substrate and the driver unit; a protection layer disposed on the patterned conductive layer, wherein the protection layer has an opening that exposes the patterned conductive layer; and a conductive material disposed in the opening.