Through-Substrate IPD Structure for Compact Passive Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electronic packages and manufacturing methods result in excessive costs, decreased reliability, and large package sizes with relatively low performance.
Innovation Solution
The development of an electronic device with a substrate having conductive vias and embedded conductors and dielectric structures on both sides, including passive components like capacitors and inductors, which are integrated to form an integrated passive device (IPD) with improved electrical coupling and protection, using advanced manufacturing processes such as photolithography, electroless plating, and chemical vapor deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional electronic packages are used, then manufacturing is simpler, but package size is too large and performance is low
Solution Approach 1:
The patent merges multiple discrete electronic components (inductors, capacitors, resistors) into a single integrated passive device structure embedded within the substrate. This consolidation reduces the overall package size while maintaining functionality, directly resolving the contradiction between compact size and structural complexity.
Solution Approach 2:
The patent embeds passive device structures within the substrate layers, nesting multiple functional elements (conductive vias, dielectric structures, conductor traces) within each other in a hierarchical arrangement. This nesting approach enables high integration density, achieving small package size without excessive structural complexity.
2Reliability
If conventional electronic packages are used, then manufacturing processes are traditional, but reliability is decreased and cost is excessive
Solution Approach 1:
The patent divides the manufacturing process into distinct sequential stages: substrate preparation, conductor trace formation, dielectric layer deposition, via creation, and passive device embedding. This segmentation allows each process to be optimized independently using specialized techniques (photolithography, CVD, electroplating), improving reliability while managing manufacturing complexity through systematic process breakdown.
Solution Approach 2:
The patent employs advanced manufacturing parameters including photolithography for precise pattern formation, chemical vapor deposition for dielectric layers, and electroless plating for conductor traces. These parameter changes from traditional manufacturing enable superior device reliability and performance while controlling costs through high-volume manufacturability.
3Reliability
If passive structures are exposed, then manufacturing is easier, but electrical coupling is poor and protection is reduced
Solution Approach 1:
The patent performs preliminary embedding of passive device structures within dielectric layers during the manufacturing process, before final assembly. This preliminary action ensures proper electrical coupling is established during fabrication, improving reliability while the standardized embedding process keeps manufacturing complexity manageable.
Solution Approach 2:
The patent uses dielectric structures as intermediary materials that electrically couple the embedded passive devices to conductor traces and vias. These dielectric intermediaries provide both electrical connection and physical protection, resolving the contradiction between good electrical coupling and manufacturing simplicity.
4Volume of moving object
If package size is reduced, then performance improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent replaces traditional mechanical assembly methods with deposition-based manufacturing techniques (CVD, electroplating, photolithography) that can achieve sub-micron precision. This substitution enables the fabrication of compact integrated structures with high precision, resolving the contradiction between small size and manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the performance and reliability of electronic devices by reducing package size and cost while providing better electrical coupling and protection for passive structures, leading to improved inductor performance and overall device efficiency.
Implementation Method 1
using advanced manufacturing processes such as photolithography, electroless plating, and chemical vapor deposition
Implementation Method 2
using advanced manufacturing processes such as photolithography, electroless plating, and chemical vapor deposition
Data Source
AI summary
In one example, an electronic device includes a substrate with a substrate front side, a substrate rear side opposite to the substrate front side, a substrate body, and conductive vias extending through the substrate body from the substrate front side to the substrate rear side. A first construct is over the substrate front side and includes a first dielectric structure and first conductors embedded in the first dielectric structure and coupled to the conductive vias. A second construct is over the substrate rear side and includes a second dielectric structure and second conductors embedded in the second dielectric structure and coupled to the conductive vias. One or more of the first conductors or the second conductors define one or more passive devices. Other examples and related methods are also disclosed herein.