Through-Substrate Via Electrodeposition for Higher Via Density
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Solution Overview
Problem
Current methods for producing substrates with conductive vias are limited by lower density of vias per unit area and are often complex and time-consuming.
Innovation Solution
A method involving additional layers for adhesion and etching control, electrodeposition, and insulating layers to form vias with higher form factors, allowing for increased via density and simpler implementation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional methods are used to produce substrates with conductive vias, then the manufacturing process is simpler, but the via density per unit area is lower
Solution Approach 1:
The manufacturing process is divided into distinct stages: forming openings in the substrate, depositing insulating layers on the walls, forming priming layers, and electrodeposition of conductive material. This segmentation allows each step to be optimized independently, enabling higher via density while maintaining process control
Solution Approach 2:
The method performs preliminary actions by first forming openings and depositing insulating and priming layers before electrodeposition. This preliminary preparation ensures that when high-density vias are formed, the adhesion and insulation are already in place, reducing the need for additional complex steps
2Productivity
If conventional methods are used to produce substrates with conductive vias, then fewer process steps are required, but the production time is longer
Solution Approach 1:
The process maintains continuity by performing electrodeposition immediately after priming layer formation, without interrupting the manufacturing flow. The openings are formed, insulating layers are deposited, priming layers are applied, and conductive material is electrodeposited in a continuous sequence, maximizing production speed despite the increased number of steps
Solution Approach 2:
The method replaces traditional mechanical drilling and filling methods with electrodeposition, which allows for faster and more precise formation of high-density vias. The electrochemical process enables continuous deposition without mechanical intervention, improving production speed
3Reliability
If high via density is achieved, then electrical connections are improved, but adhesion between layers becomes more difficult
Solution Approach 1:
The patent applies different materials with specific properties to different locations: insulating layers are deposited on the walls of openings to provide electrical isolation, while priming layers are applied at the bottom and on conductive surfaces to ensure adhesion. This local differentiation of material properties enables both high via density and reliable adhesion
Solution Approach 2:
The priming layer acts as an intermediary between the insulating layer and the electrodeposited conductive material. This intermediate layer ensures proper adhesion and electrical connection, facilitating the formation of high-density vias with reliable electrical properties
4Quantity of substance
If openings with high form factor are used, then via density increases, but insulating layer deposition becomes more challenging
Solution Approach 1:
The patent replaces physical drilling with a chemical etching process that can precisely define opening dimensions and shapes. This chemical approach, combined with controlled electrodeposition, enables the formation of high-form-factor openings with precise insulating layer deposition on the walls, achieving high via density while maintaining manufacturing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the production of substrates with higher via density, improving electrical connections and mechanical reinforcement while simplifying the manufacturing process.
Implementation Method 1
a method for producing one or more conductive elements (124) passing through a substrate (122), comprising the following steps: a) forming a stack comprising successively (from bottom to top): a support (310), a conductive priming layer (315), and the substrate (322), crossed by openings (325) located at the locations of the future conductive elements; b) depositing, by electrodeposition, the material of the conductive elements in the openings (325) from the priming layer (315) towards the support (310)
Implementation Method 2
said insulating layer is formed by thermal oxidation
Data Source
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AI summary
The present description relates to a method for manufacturing at least one element (124) passing through a substrate (322), comprising an electrodeposition step of at least a portion of said element in an opening (325) passing through the substrate and on a portion (316) of a conductive priming layer (315) located on at least a portion of a face (122L) of the substrate, said portion (316) of priming layer being located on the same side of the opening (325) as said face (122L) of the substrate.