Through-Type Multilayer Capacitor Array with Segmented Grounding
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Solution Overview
Problem
Through-type multilayer capacitors face a conflict in increasing capacity while maintaining or enhancing equivalent series resistance, as increasing the number of laminated layers decreases the equivalent series resistance due to the parallel connection of lead parts, making it difficult to meet both demands simultaneously.
Innovation Solution
The capacitors are designed with a configuration where inner electrodes are connected to external connecting conductors on the surface, allowing the equivalent series resistance to be adjusted by varying the number and position of lead parts, specifically connecting the third grounding inner electrode directly to the terminal electrodes and the first and second grounding inner electrodes indirectly through connecting conductors, which increases the equivalent series resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of laminated layers is increased to achieve greater capacity, then the capacitance increases, but the equivalent series resistance decreases due to parallel connection of lead parts
Solution Approach 1:
The invention segments the connection paths by introducing external connecting conductors on the capacitor body surface. Instead of all inner electrodes connecting directly to terminal electrodes through individual lead parts, the grounding inner electrodes are divided into two groups: one group connects directly to terminal electrodes, while another group connects through external connecting conductors. This segmentation creates series connection paths that increase the equivalent series resistance while maintaining the increased capacitance from multiple laminated layers.
Solution Approach 2:
The external connecting conductors formed on the surface of the capacitor body serve as intermediary elements between the grounding inner electrodes and the terminal electrodes. These conductors act as mediators that extend the connection path and add resistance components in series, thereby increasing the equivalent series resistance without affecting the capacitance determined by the laminated structure.
2Adaptability or versatility
If the number of lead parts is increased to connect all inner electrodes to terminal electrodes, then the connectivity improves, but the equivalent series resistance decreases due to parallel resistance components
Solution Approach 1:
The invention segments the grounding inner electrodes into multiple groups with different connection configurations. Some grounding inner electrodes connect directly to terminal electrodes through lead parts, while others connect through external connecting conductors on the capacitor body surface. This segmentation allows the system to maintain good connectivity while creating series resistance paths that increase the equivalent series resistance.
Solution Approach 2:
The invention adds a new dimensional aspect to the connection structure by forming external connecting conductors on the surface of the capacitor body. This surface-level connection dimension complements the internal lead part connections, creating a hybrid connection architecture that achieves both good connectivity and increased equivalent series resistance through the extended current path.
Data Source
AI summary
A multilayer capacitor array includes a capacitor body, two first signal terminal electrodes, two second signal terminal electrodes, two grounding terminal electrodes, one first outer connecting conductor, and one second outer connecting conductor, where the capacitor body includes first and second signal inner electrodes, and first to third grounding inner electrodes. The first signal inner electrode is arranged to oppose the first or third grounding inner electrode with at least one insulator layer therebetween, while the second signal inner electrode is arranged to oppose the second or third grounding inner electrode with at least one insulator layer therebetween. The third grounding inner electrode is directly connected to the grounding terminal electrodes, while the first and second grounding inner electrodes are not directly connected to the grounding terminal electrodes, but are connected to the third grounding inner electrode through respective outer connecting conductors.