Through-Type Multilayer Capacitor Array Resistance Control
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Solution Overview
Problem
The existing multilayer capacitor arrays face challenges in accurately managing the resistance value of resistance components, particularly in setting higher resistance values, due to the difficulty in managing the compounding ratio of dielectric powder in resistance pastes.
Innovation Solution
The through-type multilayer capacitor array design includes multiple signal inner electrodes connected to terminal electrodes via outer connecting conductors, allowing for adjustable resistance values by varying the number and position of these connections, which enables precise control over the resistance components while maintaining or increasing capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the compounding ratio of dielectric powder in resistance paste is changed to adjust resistance value, then resistance value can be modified, but manufacturing precision and accuracy of resistance value become very hard to manage
Solution Approach 1:
The patent changes the parameter being adjusted from dielectric powder compounding ratio to the physical configuration parameters of inner electrodes (number, position, connection method). This allows resistance value adjustment through geometric parameters rather than material composition, significantly improving manufacturing precision and controllability of resistance values.
Solution Approach 2:
The patent segments the electrode structure into multiple inner electrodes (first, second, third, fourth signal inner electrodes) that can be independently positioned and connected. By segmenting the electrode function and allowing selective connection to terminal electrodes, the resistance path can be precisely controlled through configuration rather than material variation.
2Quantity of substance
If the number of laminations of insulator layers and inner electrodes is increased to set greater capacitance, then capacitance increases, but the combined resistance value of resistance components decreases
Solution Approach 1:
The patent introduces dynamic configurability in the electrode connections through outer connecting conductors. The connection state between inner electrodes and terminal electrodes can be varied to change the resistance path, allowing independent control of resistance value regardless of the number of laminations. This dynamic connection configuration decouples the relationship between capacitance (determined by lamination count) and resistance (determined by connection configuration).
Solution Approach 2:
The patent establishes preliminary connection paths through outer connecting conductors that can be configured before final assembly. By pre-defining which inner electrodes connect to which terminal electrodes, the resistance characteristics can be determined in advance independently of the capacitance-determining lamination structure.
Data Source
AI summary
A through-type multilayer capacitor array comprises a capacitor body, and two first signal terminal electrodes, two second signal terminal electrodes, two grounding terminal electrodes, a first outer connecting conductor, and a second outer connecting conductor. The capacitor body includes a grounding inner electrode, and first to fourth signal inner electrodes. The grounding inner electrode is arranged to oppose the first or second signal inner electrode with an insulator layer in between and oppose the third or fourth signal inner electrode with an insulator layer in between while being connected to the grounding terminal electrodes. The first signal inner electrode is connected to the first signal terminal electrodes and first outer connecting conductor. The third signal inner electrode is connected to the second signal terminal electrodes and the second outer connecting conductor. The second and fourth signal inner electrodes are respectively connected to the first and second outer connecting conductor.