Through-Type Multilayer Ceramic Capacitor Center Electrode

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Solution Overview

Problem

Conventional through-type multilayer ceramic capacitors face challenges with strength during installation on circuit boards, leading to potential cracking and moisture ingress, which can cause electrode corrosion and shorting.

Innovation Solution

The design incorporates a third external electrode of quadrangular cylinder shape at the capacitor body's center, with specific length and area ratios, and increased thicknesses of external electrode parts to distribute installation loads and enhance electrical connections, preventing cracking and ensuring reliable sealing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the capacitor body is made thinner to reduce size, then the size is reduced, but the strength during installation deteriorates

Engineering Contradiction:
Improvecapacitor sizeVSAvoidinstallation strength
Core Design Contradiction:
Volume of moving objectVSStrength

Solution Approach 1:

The invention divides the external electrode structure into multiple segments: first external electrodes at both ends of the capacitor body, and a second external electrode at the center. This segmentation allows the load during installation to be distributed across multiple electrode regions rather than concentrated on the capacitor body itself, thereby maintaining installation strength even when the capacitor body is made thinner.

Inventive Principle:
Principle #1Segmentation

2Ease of operation

If the load is applied directly to the capacitor body during installation, then the installation process is simple, but cracks may occur in the capacitor body

Engineering Contradiction:
Improveinstallation simplicityVSAvoidcrack resistance
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The invention introduces the second external electrode at the center of the capacitor body as an intermediary load-bearing element. During installation, the pickup nozzle applies load to this second external electrode rather than directly to the capacitor body. This intermediary structure transfers and distributes the mechanical stress, preventing cracks while maintaining straightforward installation procedures.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Strength

If the external electrode coverage is increased to improve strength, then the installation strength is improved, but the device complexity increases

Engineering Contradiction:
Improveinstallation strengthVSAvoidelectrode structure complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The second external electrode at the center serves multiple functions: it acts as a load-bearing element during installation, provides an additional electrical connection point, and serves as a reference for positioning. By making this single structural element multi-functional, the invention achieves improved installation strength without proportionally increasing device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS9922770B2Through-type multilayer ceramic capacitor
Publication Date: 2018.03.20 TAIYO YUDEN KK
  • US9922770B2 patent drawing
  • US9922770B2 patent drawing
  • US9922770B2 patent drawing

AI summary

In an embodiment, a through-type multilayer ceramic capacitor 10-1 has a first external electrode 12 provided on one end of the capacitor body 11 in the length direction, and a second external electrode 13 provided on the other end of the capacitor body 11 in the length direction, and it also has a third external electrode 14 of quadrangular cylinder shape provided at the center of the capacitor body 11 in a manner continuously covering parts of both sides in the height direction, and parts of both sides in the width direction, of the capacitor body 11, in a state not contacting the first external electrode 12 and second external electrode 13. The through-type multilayer ceramic capacitor can offer improved strength at the time of installation on a circuit board.