Through-Via Adhesion Layers for Delamination-Resistant IC Packaging
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Solution Overview
Problem
The challenge in semiconductor packaging is to enhance the adhesion strength between conductive features and encapsulants to prevent delamination during processing and improve manufacturing yield and reliability of integrated circuit packages.
Innovation Solution
Formation of adhesion layers made of an adhesive compound that chemically bonds to both the conductive features and the encapsulant material, specifically using an aromatic compound that forms coordinate covalent bonds with metals and covalent bonds with a polymer resin, thereby improving the adhesion strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional packaging techniques are used without adhesion layers, then the device complexity is reduced, but the adhesion strength between conductive features and encapsulants deteriorates, causing delamination during processing
Solution Approach 1:
An adhesion layer is introduced as an intermediary between the conductive feature and the encapsulant. This adhesion layer includes an adhesive compound with an aromatic compound that forms coordinate covalent bonds with the metal of the conductive feature and covalent bonds with the polymer resin of the encapsulant, thereby significantly improving adhesion strength and preventing delamination during processing
Solution Approach 2:
The adhesion layer is formed as a composite structure combining an adhesive compound with specific chemical groups (aromatic compound, amino group, carboxyl group, hydroxyl group, or thiol group) that can chemically bond to both the conductive feature and the encapsulant, creating a multi-functional interface layer that enhances overall bond strength
2Reliability
If adhesion layers with adhesive compounds are formed on conductive features, then the reliability of integrated circuit packages is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The adhesive compound is designed with specific chemical parameters including functional groups (amino group, carboxyl group, hydroxyl group, or thiol group) that enable selective chemical bonding. The compound is applied in controlled concentrations (e.g., 0.01% to 100% by weight in the adhesive solution) and under controlled conditions (pH 5-12, temperature 20°C to 80°C, soaking time 5 seconds to 10 minutes) to achieve reliable adhesion while maintaining manufacturability
Solution Approach 2:
The adhesive compound selectively bonds to the metal surfaces of conductive features through self-assembly mechanisms, where the aromatic compound portion automatically coordinates with metal atoms while the functional group portions orient toward the encapsulant, reducing the need for precise manual positioning and simplifying the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the adhesion between conductive features and encapsulants, reducing delamination and improving manufacturing yield and reliability of integrated circuit packages.
Implementation Method 1
an adhesive compound that can be selectively deposited on the conductive features... The adhesive compound chemically bonds to the material of the conductive features
Implementation Method 2
the adhesive compound chemically bonds to the material of the conductive features and the material of the encapsulant
Data Source
AI summary
In an embodiment, a device includes: a semiconductor die including a semiconductor material; a through via adjacent the semiconductor die, the through via including a metal; an encapsulant around the through via and the semiconductor die, the encapsulant including a polymer resin; and an adhesion layer between the encapsulant and the through via, the adhesion layer including an adhesive compound having an aromatic compound and an amino group, the amino group bonded to the polymer resin of the encapsulant, the aromatic compound bonded to the metal of the through via, the aromatic compound being chemically inert to the semiconductor material of the semiconductor die.