Through Via Inserts for Thermal Management in Stacked Packages
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Solution Overview
Problem
Current thermal design for multiple stacked packages with heat spreaders adds thickness and cost, and does not dissipate heat efficiently, as it requires fillers and has height discrepancies between packages.
Innovation Solution
The use of through via inserts (TVIs) coupled to an interposer and package substrate, which provide both heat dissipation and electrical paths, eliminating the need for fillers and enhancing thermal conductivity by allowing heat dissipation from multiple directions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat spreader with fillers is used to dissipate heat from multiple stacked packages, then heat dissipation is achieved, but package thickness increases and manufacturing cost increases
Solution Approach 1:
The patent transitions from horizontal heat dissipation (through fillers to heat spreader) to vertical heat dissipation (through TVIs to package substrate). The TVIs extend through the interposer thickness, creating a three-dimensional thermal conduction path that eliminates the need for lateral filler materials and reduces overall package thickness.
Solution Approach 2:
The TVI structure serves multiple functions simultaneously: it provides electrical interconnection between packages and substrate, enables vertical heat dissipation pathways, and eliminates the need for separate filler components. This multi-functionality reduces both thickness and manufacturing complexity.
2Temperature
If fillers are used to couple packages with heat spreader, then physical contact is achieved for heat dissipation, but manufacturing cost increases
Solution Approach 1:
The TVI structure combines electrical interconnection and thermal management functions into a single component, eliminating the need for separate filler materials. This integration reduces component count, simplifies assembly processes, and lowers manufacturing costs.
Solution Approach 2:
The patent merges the electrical interconnect function and thermal conduction function into the same TVI structure. The conductive material within TVIs serves dual purposes: establishing electrical pathways and providing thermal conduction pathways, thereby eliminating the need for additional filler components.
3Adaptability or versatility
If packages of different heights are stacked, then design flexibility is achieved, but filler materials are required to achieve physical contact with heat spreader
Solution Approach 1:
The patent resolves height discrepancies by transitioning from horizontal alignment (requiring fillers) to vertical integration. TVIs extend vertically through the interposer, allowing packages of different heights to be stacked without requiring lateral filler materials to achieve contact with the heat spreader.
Solution Approach 2:
The TVI structure provides localized thermal and electrical conduction pathways at specific locations through the interposer. This allows different regions of the stacked package structure to have optimized thermal management without requiring uniform filler materials across the entire structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces package thickness, eliminates the need for fillers, and improves heat dissipation efficiency, allowing packages to operate at lower temperatures and maintain better performance.
Implementation Method 1
The first set of TVI is configured to provide heat dissipation from the first package
Implementation Method 2
the heat spreader is configured to dissipate heat from the first package
Data Source
AI summary
Some implementations provide a semiconductor package structure that includes a package substrate, a first package, an interposer coupled to the first package, and a first set of through via insert (TVI). The first set of TVI is coupled to the interposer and the package substrate. The first set of TVI is configured to provide heat dissipation from the first package. In some implementations, the semiconductor package structure further includes a heat spreader coupled to the interposer. The heat spreader is configured to dissipate heat from the first package. In some implementations, the first set of TVI is further configured to provide an electrical path between the first package and the package substrate. In some implementations, the first package is electrically coupled to the package substrate through the interposer and the first set of TVI. In some implementations, the first set of TVI includes a dielectric layer and a metal layer.