Through Via Structure for Heat Dissipation and Optical Transmission
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Solution Overview
Problem
Silicon-photonic devices face challenges with heat dissipation and optical signal transmission due to bulky heat spreaders and indirect optical connections, leading to decreased transmission speed and increased power loss.
Innovation Solution
The package device incorporates through via structures with a heat dissipation region and an optical transmission region, allowing for direct optical coupling and efficient heat transfer, using thermal interface materials and optical fibers to connect photonic components, thereby improving transmission speed and power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If bulky heat spreaders are used, then heat dissipation is improved, but device complexity and space occupation increase
Solution Approach 1:
The patent merges the heat dissipation function and optical transmission function into a single through via structure. The through via structure includes both a heat dissipation region with thermal interface materials and an optical transmission region with optical fibers, eliminating the need for separate bulky heat spreaders while maintaining effective heat dissipation and optical connectivity.
Solution Approach 2:
The through via structure serves multiple functions simultaneously: it acts as a heat dissipation path through the heat dissipation region with thermal interface materials, and as an optical transmission path through the optical transmission region with optical fibers. This multi-functional design reduces overall device complexity and space requirements.
2Device complexity
If indirect optical connections are used, then device complexity is reduced, but transmission speed decreases and power loss increases
Solution Approach 1:
The through via structure is segmented into distinct functional regions: a heat dissipation region containing thermal interface materials and a transmission region containing optical fibers. This segmentation allows each region to perform its specific function optimally without interfering with the other, enabling direct optical connectivity while maintaining heat dissipation efficiency.
3Reliability
If separate heat dissipation and optical transmission structures are used, then functional requirements are met, but space occupation and device complexity increase
Solution Approach 1:
The patent combines the heat dissipation structure and optical transmission structure into a single integrated through via structure. The heat dissipation region with thermal interface materials is positioned adjacent to the optical transmission region with optical fibers within the same through via, eliminating redundant structures and reducing overall space occupation while maintaining both thermal and optical functional requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient heat dissipation and direct optical transmission, enhancing the performance of silicon-photonic devices by improving heat transfer rates and reducing power consumption while maintaining transmission speed.
Implementation Method 1
The thermal structure is over the first IC and the second IC and configured to dissipate heat
Implementation Method 2
a first optical structure penetrating through the thermal structure and optically coupled to the first IC; and a second optical structure penetrating through the thermal structure and optically coupled to the second IC
Data Source
AI summary
A package device is provided. The package device includes a first die and a first through via structure. The first die has a first optical I/O. The first through via structure is over the first die. A first region of the first through via structure is configured to dissipate heat from the first die and a second region of the first through via structure is configured to transmit an optical signal to or from the first optical I/O.