Through-Via Organic Interface Layer for Delamination-Resistant Packaging
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Solution Overview
Problem
Existing semiconductor packages face issues with delamination and cracks during the grinding process due to differences in elongation rates between the through-via structure and the encapsulant, which affect reliability and yield.
Innovation Solution
Incorporating an organic material layer with a higher elongation rate than the encapsulant between the through-via structure and the encapsulant to compensate for the difference in elongation rates, using compounds like mercapto group or phosphate compounds to enhance adhesive force and prevent delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an organic material layer with higher elongation rate is inserted between the through-via structure and the encapsulant, then the reliability is improved by preventing delamination and cracks, but the device complexity increases due to additional layers and materials
Solution Approach 1:
An organic material layer is inserted between the through-via structure and the encapsulant to act as an intermediary. This layer has a higher elongation rate than the encapsulant, allowing it to absorb differential stress and prevent delamination and cracks during the grinding process, thereby improving reliability while managing the complexity through a targeted intermediate solution.
Solution Approach 2:
The patent employs composite material structures by combining the organic material layer with specific compounds (mercapto group or phosphate compounds) to create a multi-layered interface between the through-via structure and encapsulant. This composite approach enhances adhesive force and stress distribution, resolving the contradiction between improved reliability and increased device complexity.
2Strength
If compounds with mercapto group or phosphate compounds are used in the organic material layer, then the adhesive force is enhanced to prevent delamination, but the manufacturing precision requirements increase due to stricter material selection and application control
Solution Approach 1:
The patent specifies particular chemical parameters for the organic material layer by requiring the inclusion of mercapto group or phosphate compounds. These parameter specifications enhance adhesive force through chemical bonding mechanisms while establishing clear material criteria that guide manufacturing processes, thereby balancing improved strength with manageable manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The organic material layer improves the reliability and yield of semiconductor packages by preventing delamination and cracks, ensuring a stable connection between the through-via structure and the encapsulant.
Implementation Method 1
an organic material layer between the through-via structure and the encapsulant and having an elongation rate greater than an elongation rate of the encapsulant
Implementation Method 2
an organic material layer extending along a side surface of the through-via structure and including a compound having a mercapto group or a phosphate compound
Data Source
AI summary
A semiconductor package includes a first redistribution structure including a first redistribution layer; a semiconductor chip on a first surface of the first redistribution structure and including a connection pad electrically connected to the first redistribution layer; an encapsulant that surrounds at least a portion of the semiconductor chip; a second redistribution structure on the encapsulant and including a second redistribution layer; a through-via structure that extends through the encapsulant and electrically connects the first redistribution layer to the second redistribution layer; an organic material layer between the through-via structure and the encapsulant and having an elongation rate greater than an elongation rate of the encapsulant; and a bump structure on a second surface of the first redistribution structure.