Through Via Package With Molding Compound Protection
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Solution Overview
Problem
The challenge in integrated circuit packaging is the complication of electrically connecting stacked integrated circuits without damaging the active side structures during processing of the inactive side, which often results in poor reliability due to chemical etchants seeping through protective substrates and leaving residues.
Innovation Solution
The method involves forming conductive through vias in a reconstituted substrate to connect active and inactive sides of an integrated circuit die, using molding compound to protect the active side during inactive side processing, and partially removing the molding compound to expose solder structures for additional connections, thereby avoiding residue issues and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive through vias are formed to connect active and inactive sides, then electrical connection reliability is improved, but processing complexity increases due to the need to protect active side structures during inactive side processing
Solution Approach 1:
The active side is covered with molding compound before processing the inactive side. This preliminary protective action prevents chemical etchants from damaging active side structures during through via formation and redistribution line processing on the inactive side, thereby enabling reliable electrical connections without compromising device integrity
Solution Approach 2:
Molding compound serves as an intermediary protective layer between the active side structures and the chemical etchants used during inactive side processing. This intermediary prevents direct contact between harmful chemicals and sensitive active side structures, allowing complex through via processing to proceed safely
2Object-affected harmful factors
If protective substrates are used during inactive side processing, then active side structures are protected, but chemical etchants seep through and leave residues that reduce reliability
Solution Approach 1:
The molding compound acts as a disposable protective barrier that is applied to cover the active side, allows inactive side processing to complete, and is then removed. This single-use protective approach is more effective than reusable substrates because it completely prevents chemical seepage without leaving residues that would compromise reliability
3Area of stationary object
If stacked integrated circuits are used to save surface area, then device footprint is reduced, but electrical connection complications increase
Solution Approach 1:
The patent transitions from planar electrical connections to three-dimensional vertical connections through through vias that penetrate the substrate. This dimensional change enables stacked circuit configuration, allowing multiple integrated circuits to be connected vertically, thereby reducing surface area while the molding compound protection system manages the increased connection complexity
Data Source
AI summary
An integrated circuit package includes an integrated circuit die in a reconstituted substrate. The active side is processed then covered in molding compound while the inactive side is processed. The molding compound on the active side is then partially removed and solder balls are placed on the active side.