Through-Via Semiconductor Package Structure for Low-Distortion Signals
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing leadframe packages are unsuitable for high-speed semiconductor dies due to increased mutual inductance and capacitance from narrow lead pitches, leading to signal distortion and higher packaging costs.
Innovation Solution
A semiconductor package structure with a through via passing through the semiconductor substrate, coupled to a conductive adhesive layer, which improves electrical performance and reliability by reducing resistance and enhancing signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the lead pitch is reduced to accommodate more connection pins in a smaller space, then the package size is reduced, but the mutual inductance and mutual capacitance increase causing signal distortion
Solution Approach 1:
The patent introduces through-vias that extend vertically through the semiconductor substrate, adding a vertical dimension to electrical connections. This allows signal paths to be routed through the thickness of the substrate rather than relying solely on horizontal lead paths, effectively utilizing the third dimension to reduce parasitic effects while maintaining compact package dimensions.
Solution Approach 2:
The conductive adhesive layer serves as an intermediary element that couples the through-vias to the leadframe structure. This intermediate conductive layer provides a low-inductance connection path between the substrate and external leads, reducing the overall parasitic inductance and capacitance in the signal path.
2Adaptability or versatility
If the number of external connection pins is increased to provide more functionality, then the functionality is improved, but the packaging cost increases
Solution Approach 1:
By utilizing vertical through-vias through the substrate, the patent enables additional connection points without proportionally increasing package footprint. This vertical routing approach allows more functional connections to be achieved within the same planar area, reducing the need for additional external pins and associated packaging complexity.
3Length of moving object
If the lead pitch is narrowed to reduce package size, then the package becomes more compact, but the mutual inductance and mutual capacitance increase
Solution Approach 1:
The through-via structure transforms horizontal current paths into vertical paths through the substrate. This dimensional change reduces the loop area for current flow, thereby minimizing mutual inductance and capacitance effects even when leads are closely spaced, allowing narrow pitch without sacrificing electrical performance.
Solution Approach 2:
The conductive adhesive layer acts as an intermediary that provides direct vertical coupling between the through-vias and leadframe, creating short current paths that minimize the development of parasitic inductance and capacitance that would otherwise arise from narrow horizontal lead spacing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure enhances electrical performance and reliability by minimizing signal distortion and reducing packaging costs while maintaining a compact form factor.
Implementation Method 1
The conductive adhesive layer is disposed on the second surface of the semiconductor substrate. The through via is coupled to the conductive adhesive layer.
Data Source
AI summary
A semiconductor package structure and a method for forming the same are provided. The semiconductor package structure includes a semiconductor die and a conductive adhesive layer. The semiconductor die includes a semiconductor substrate, a semiconductor substrate and a through via. The semiconductor substrate has a first surface and a second surface. The semiconductor device is formed on the first surface of the semiconductor substrate. The through via is formed in such a way that it passes through the semiconductor substrate. The conductive adhesive layer is disposed on the second surface of the semiconductor substrate. The through via is coupled to the conductive adhesive layer.