Through-Via Test Board for Accurate Power Measurement
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Solution Overview
Problem
The challenge of performing accurate system-level power consumption measurements on electronic devices, particularly those packaged in high-density electronic apparatuses like cellphones, is exacerbated by blocked pins and high-speed signal sensitivity, making traditional extension and external connection methods unreliable and risky.
Innovation Solution
A test system with a circuit board that includes conductive vias and metal contacts, allowing for direct signal lead-out to metal pads, avoiding pin blockage and signal distortion, and optionally using an intermediate plate to ensure safe mounting and space efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If traditional extension and external connection methods are used for power consumption measurement, then measurement accessibility is improved, but signal integrity and measurement reliability deteriorate due to pin blockage and high-speed signal sensitivity
Solution Approach 1:
The patent introduces a circuit board as an intermediary component between the electronic device and the power consumption measurement system. The circuit board includes a conductive via that extends through the board, with a first metal contact on the first side coupled to a second metal contact on the second side through the conductive via. This intermediary structure allows measurement connections to be made on the first side of the circuit board while maintaining reliable electrical connection to the device pins on the second side, thus solving both accessibility and signal integrity requirements
Solution Approach 2:
The patent transitions the measurement connection from a two-dimensional surface connection to a three-dimensional through-board connection. By extending the conductive via through the entire thickness of the circuit board and making contacts on both sides, the solution utilizes the third dimension (depth/thickness) to establish reliable electrical connection while maintaining accessibility on the accessible side
2Adaptability or versatility
If pins are blocked in packaged electronic devices, then device integration is improved, but power consumption measurement capability deteriorates
Solution Approach 1:
The patent segments the measurement function into two separate sides: the first side of the circuit board for measurement instrument connection, and the second side for device pin connection. This segmentation allows the measurement system to access power consumption data without interfering with the packaged device's pin configuration, thus maintaining both device integration and measurement capability
Solution Approach 2:
Instead of trying to access blocked pins directly, the patent inverts the approach by making measurement connections on the opposite side of the circuit board from where the device pins are located. The conductive via acts as an inverted connection path, going through the board rather than accessing pins from the same side
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise system-level power consumption measurements without damaging the device, ensuring accurate data collection and reducing risks of signal interference and short circuits.
Implementation Method 1
a dielectric layer including at least one conductive via extending through the dielectric layer; a plurality of first metal contacts disposed on a first side of the dielectric layer, and a plurality of second metal contacts disposed on a second side of the dielectric layer, where at least one of the plurality of first metal contacts is coupled with the second metal contacts through the conductive via
Data Source
AI summary
The present disclosure provides a circuit board, a test system and a test method in the technical field of power consumption testing. The circuit board includes: a dielectric layer including at least one conductive via extending through the dielectric layer; first metal contacts disposed on a first side of the dielectric layer and second metal contacts disposed on a second side of the dielectric layer, wherein at least one of the first metal contacts is coupled with the second metal contacts through the conductive via; and at least one first metal pad located on the first side of the dielectric layer and at peripheries of the first metal contacts, wherein the first metal pad is coupled with at least one first metal contact through a first wiring in the dielectric layer.